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SK hynix considering building new back-end process plant in S. Korea  25/06/24
SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
Samsung Invests Aggressively in Next-Gen DRAM Production as Yields Improve  25/06/20
According to industry sources on July 19, Samsung Electronics achieved a 50-70% yield rate in performance tests of 10nm (nanometer) class 6th-generation DRAM wafers last month. This marks substantial progress compared to the less than 30% yield rate recorded for the same product last year.
Micron Announces DDR4 Sunset Amid Stronger?Than?Ever Demand  25/06/16
In a recent interview, Micron's Executive Vice President and Chief Business Officer, Sumit Sadana, acknowledged that the phase?out comes at a time when demand for DDR4 remains unexpectedly strong. He noted that shortages of both DDR4 and LPDDR4 modules have driven spot-market prices to levels that, in some cases, exceed those of newer DDR5 products.
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2018-04-23
Global semiconductor packaging materials market reaches US$16.7 billion in 2017
2018-04-23
TSMC may post record profits for 2018 on 7nm volume production
2018-04-20
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2018-04-20
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2018-04-18
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MediaTek 2Q18 revenues likely to rise over 20%
2018-04-17
U.S. Cuts Off China's ZTE From American Tech for Seven Years
2018-04-17
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