With its eighth-generation TPU, Google breaks from the tradition of single-chip iteration by splitting training and inference into two distinct chips: the TPU 8t designed for large-scale training, and the TPU 8i optimized for inference and AI agents. This enables precise matching of the different demands of AI scenarios.

Chey reiterated that the memory supply bottlenecks triggered by the widespread adoption of AI are expected to persist until 2030. He pointed out that not only is global capital pouring into AI data center construction, but Nvidia's upcoming AI PC architecture will also create rigid demand for high-capacity memory, providing long-term growth momentum for the memory market.

After roughly 18 months of development, Crescent Island is expected to begin customer sampling later this year. Intel is also exploring manufacturing options that could leverage its own fabs, potentially enhancing cost competitiveness through greater vertical integration.

Samsung Electronics announced that it has begun shipping the industry’s first 12-layer HBM4E samples to major global customers, further strengthening its leadership in the next-generation HBM market.

Alper Ilkbahar, CTO and EVP of Sandisk, said in a recent media interview that the global AI race is becoming increasingly memory-centric rather than compute-centric, which could exacerbate an unprecedented tight supply of memory chips. He also provided an update on HBF, revealing that the wafer is currently being designed, samples of the HBF chip will be available by the end of this year, and the complete product with a controller is expected to launch next year.

Driven by supply-demand mismatches, contract prices for DRAM and NAND rose significantly quarter-on-quarter, and the bargaining power of original manufacturers improved markedly. The tight-supply-driven price increase pattern remained highly sustainable. According to CFM analysis, the global DRAM/NAND Flash market size reached US$137.14 billion in the first quarter of 2026, an increase of 81.6% quarter-on-quarter and 245% year-on-year, setting a new all-time quarterly high.

According to the latest reports from South Korean media, labor negotiations between Samsung Electronics and the union broke down again today (May 20). The Samsung Electronics union has officially announced that it will proceed with the general strike as planned tomorrow (May 21). Management has explicitly rejected the strike proposal. Calls from Samsung shareholders for an emergency arbitration process are growing increasingly urgent.

According to reports that South Korean media citing internal sources, Samsung Electronics' DS division has recently increased the yield of its 10nm-class fifth-generation (1b) DRAM, used in the core chips of HBM3E, to 92% (based on cold test). In addition, the yield of sixth-generation (1c) DRAM, to be installed in HBM4, has been raised to over 75%.

According to a South Korean media report, Samsung Electronics activated an emergency management system for its semiconductor production lines one week before a general strike.

According to ZDNet, citing industry sources, SK hynix is collaborating with Intel on the research and development of 2.5D packaging technology. It is reported that SK Hynix is considering adopting Intel's 2.5D packaging technology, known as “Embedded Multi-die Interconnect Bridge” (EMIB), and is currently conducting tests to combine HBM and system semiconductors with EMIB-embedded substrates supplied by Intel.

Chung-Won Shu, Chairman of Transcend, stated that artificial intelligence has triggered a comprehensive boom in Taiwan's hardware industry. In particular, the memory industry has entered a super cycle. He expects that DRAM and NAND Flash will face shortages not only this year but definitely next year, and could still remain in short supply as late as 2028. He predicts that prices will continue to rise, though whether end applications can absorb the sustained price increases requires close monitoring.

Samsung Electronics' latest financial results show that in Q1 2026 its revenue reached 133.9 trillion South Korean won, up 43% quarter-on-quarter and 69% year-on-year. Operating profit stood at 57.2 trillion won, surging 184.6% quarter-on-quarter and 7.5 times year-on-year. Net profit hit 47.2 trillion won, rising 140.5% quarter-on-quarter and 4.8 times year-on-year. Its Q1 memory business revenue came in at 74.8 trillion won, up 101% quarter-on-quarter and 292% year-on-year. Samsung Electronics stated that its HBM shipments in the first quarter more than tripled year over year. Starting from Q2 2026, the company plans to supply prototype products of its 7th-generation HBM (HBM4E) to key customers. It expects HBM4 shipments to account for over half of total HBM shipments beginning in the third quarter.

SK Hynix expects that in the second quarter, DRAM bit shipments will increase 7%-9% quarter-on-quarter, and NAND bit shipments (including Solidigm) will increase 16%-17% quarter-on-quarter.

According to Taiwan media reports, TSMC plans to launch its advanced packaging plant in Arizona, US, in 2029 to better serve the needs of American CSP customers, seize high-end packaging orders for AI and HPC, and strengthen its local supply chain presence. In addition, TSMC unveiled upgraded roadmaps for CoWoS and 3D stacking at its 2026 North America Technology Symposium, elevating the role of packaging from "supporting" to "system core."

According to Korean media reports, industry insiders have revealed that Samsung Electronics' 1c DRAM yield has recently reached a significant level, estimated to have exceeded 80%, achieving what is called a "mature yield." However, the industry generally believes that this cannot be directly equated with the mass production yield of HBM4.