Industry sources indicate that Samsung Electronics will simultaneously launch a "conversion investment" for advanced NAND flash memory in the second quarter of this year, focusing on upgrading its X2 production line in Xi'an, China. This line currently primarily produces 6th and 7th generation NAND, and will be converted to produce 280-layer V9 NAND, aiming to increase monthly capacity by 40,000 to 50,000 wafers. Simultaneously, its P1 campus in Pyeongtaek, South Korea, is also preparing for similar capacity expansion.

On February 3, Intel launched the new Intel Xeon 600 Series workstation processor, delivering significant improvements across multiple aspects compared to the previous generation. These enhancements include a substantial increase in core count, enhanced PCIe connectivity, support for higher memory speeds, and unprecedented energy efficiency.

The new processor is built on the Intel 3 process technology and feature the Redwood Cove+ core architecture. It offers up to 128 PCIe Gen5 lanes and supports up to eight channels of DDR5 RDIMM memory at speeds of up to 6400 MT/s—surpassing 4800 MT/s of the previous generation platform. Additionally, it adds support for DDR5 MRDIMM memory, which can reach speed of up to 8,000 MT/s, delivering a significant boost in performance for memory-intensive workloads.

Sales through OEMs/system integrators and standalone boxed processors will begin in late March 2026.

According to the Sci-Tech Innovation Board Daily, Chen Peiming, the general manager of memory manufacturer Winbond, stated that the memory market outlook for this year remains highly favorable. Contract prices in the first quarter will maintain the same level of increase as in the fourth quarter of 2025, while second-quarter contract prices are currently under negotiation. Both existing and newly added production capacity for this year and 2027 have already been fully sold and booked.

According to the press release on SoftBank's official website dated February 3, its subsidiary SAIMEMORY signed a cooperation agreement with Intel on February 2, 2026, to jointly commercialize ZAM (Z-Angle Memory). ZAM adopts a stacked DRAM architecture and is the next-generation memory technology featuring high capacity, wide bandwidth, and low power consumption. The company plans to create prototypes in fiscal year 2027 and achieve commercialization in FY2029. This next-generation storage technology, known as "ZAM," will provide high-capacity, high-bandwidth data processing capabilities, enhanced processing performance, and lower power consumption for data centers and other scenarios requiring large-scale AI model training and inference processing.

On February 3, 2026, Google Cloud and Liberty Global announced a five-year strategic partnership in AI to accelerate the digital transformation and large-scale deployment of AI in their European operations. The partnership focuses on three core areas: first, integrating the Gemini model to optimize end-user service experiences and exploring collaborations with Google consumer products; second, creating AI pilot projects to upgrade telecommunications network capabilities and develop an independent network operation system; and third, jointly developing the SME market, exploring telecommunications data monetization, and uncovering new growth opportunities in areas such as Formula E.

On the evening of February 2, Maxio Technology released its 2025 annual performance bulletin. During the reporting period, the company achieved total operating revenue of 1.33 billion yuan, with a year-on-year increase of 13.42%. Net profit attributable to the parent company reached 142 million yuan, up 20.36% year-on-year, while net profit after deducting non-recurring gains and losses amounted to 101 million yuan, representing a significant increase of 130.29% compared to the same period last year. 

Recently, several storage companies have launched their IPO processes. Hongxinyu Electronics, Xintianxia, ​​and Xingchen Tianhe have all submitted applications to the Hong Kong Stock Exchange. Meanwhile, Unisplendour Corporation has filed for a listing on the Beijing Stock Exchange; and Dapu Microelectronics, which has already received approval for its registration on the ChiNext board, is also expected to become the first listed enterprise-level SSD company in China. The capitalization process in the storage industry has accelerated significantly.

According to Taiwanese media reports, Huang revealed at a "trillion-dollar banquet" in Taipei that NVIDIA is currently in full-scale mass production of its Blackwell and Rubin platforms, creating a huge demand for TSMC wafers and CoWoS packaging. He predicts TSMC's production capacity will double in the next ten years and emphasized that AI development relies on high-end memory. Meanwhile, NVIDIA confirmed it is collaborating with MediaTek to develop low-power, high-AI computing power PC system-on-a-chip, entering the AI ​​PC market.

Reports indicate that TSMC's 2nm capacity has been fully booked by major global technology companies. AMD plans to produce 2nm CPUs in 2026; Google and Amazon Web Services (AWS) are expected to adopt this process in the third and fourth quarters of 2027, respectively. Furthermore, Nvidia aims to launch its "Feynman AI" GPU based on TSMC's next-generation A16 (back-powered) process in 2028.

According to the latest news, Huawei topped the Chinese smartphone market in January 2025 with an 18.6% market share. Its flagship Mate 80 series performed strongly, with cumulative sales exceeding 2.54 million units by the end of January. Among them, the standard version saw over 1.5 million activations, becoming the best-selling domestic high-end single product in the second half of last year.

According to South Korean media reports, Samsung Electronics has officially resumed investment in its NAND flash memory production line at its Pyeongtaek P4 plant and has begun moving in production equipment. This investment had previously been delayed due to the sluggish market. As part of a large-scale investment plan for 2026, Samsung plans to allocate approximately 10 trillion won in additional capital expenditure, focusing on increasing DRAM, NAND flash memory, and wafer foundry capacity. After the expansion of the Pyeongtaek plant, it is expected to increase monthly NAND chip production capacity by 60,000 wafers, DRAM production capacity by 30,000 wafers, and wafer foundry capacity by 20,000 wafers.

According to data released by the Ministry of Trade, Industry and Energy of South Korea, the country's exports in January 2026 reached $65.85 billion, with a year-on-year increase of 33.9%, surpassing $60 billion for the first time and setting a new historical record. Among these, semiconductor export performed particularly strongly, with export value reaching $20.5 billion in January, a year-on-year increase of 102.7%, marking the second consecutive month that export have exceeded $20 billion. The Ministry of Science and ICT of South Korea analyzed that the growth in semiconductors is primarily attributed to the expanding demand for high-value-added memory chips and the continuous price increase of general-purpose semiconductors such as DRAM. Driven by the global AI boom, South Korea's semiconductor industry, represented by Samsung Electronics and SK Hynix, has emerged as a major beneficiary.

On February 2, Lenovo announced that the new Legon Y700 tablet will be officially launched in March. Official promotional images reveal that the device features an updated design, including the removal of the traditional flash in favor of a circular RGB light ring. No visible ventilation openings are seen on the body, suggesting it may not be equipped with an active cooling system. The new tablet will be available in black and white color and featured a physical card slot on the side, likely supporting SIM card.According to related reports, the new Y700 will be equipped with an 8.8-inch LCD display featuring 3K resolution, a 165Hz refresh rate, and a 16:10 aspect ratio. It is expected to be powered by the Snapdragon 8 Elite Gen 5 processor, with an oversized vapor chamber for thermal management. The battery capacity is anticipated to increase to 9,000mAh.

According to foreign media reports, AMD's next-generation Zen 6 architecture processors will feature a major design overhaul. Its Core Composite Diode (CCD) will break away from the long-standing 8-core design, significantly increasing the core count to 12 cores, while simultaneously increasing the L3 cache capacity by 50%. Despite the significant increase in core and cache size, the new generation CCD maintains excellent chip area control, only increasing by approximately 7% compared to the current Zen 5 architecture.

Xiaomi's next-generation SU7 auto has completed development and is about to enter the mass production phase. Xiaomi founder Lei Jun announced in a recent live stream that the first batch of vehicles is expected to arrive at dealerships in seven cities, including Beijing, Shanghai, and Guangzhou, starting February 13th (before the Spring Festival), allowing consumers to experience the new car firsthand.