Samsung Electronics' latest financial results show that in Q1 2026 its revenue reached 133.9 trillion South Korean won, up 43% quarter-on-quarter and 69% year-on-year. Operating profit stood at 57.2 trillion won, surging 184.6% quarter-on-quarter and 7.5 times year-on-year. Net profit hit 47.2 trillion won, rising 140.5% quarter-on-quarter and 4.8 times year-on-year. Its Q1 memory business revenue came in at 74.8 trillion won, up 101% quarter-on-quarter and 292% year-on-year. Samsung Electronics stated that its HBM shipments in the first quarter more than tripled year over year. Starting from Q2 2026, the company plans to supply prototype products of its 7th-generation HBM (HBM4E) to key customers. It expects HBM4 shipments to account for over half of total HBM shipments beginning in the third quarter.

SK Hynix expects that in the second quarter, DRAM bit shipments will increase 7%-9% quarter-on-quarter, and NAND bit shipments (including Solidigm) will increase 16%-17% quarter-on-quarter.

According to Taiwan media reports, TSMC plans to launch its advanced packaging plant in Arizona, US, in 2029 to better serve the needs of American CSP customers, seize high-end packaging orders for AI and HPC, and strengthen its local supply chain presence. In addition, TSMC unveiled upgraded roadmaps for CoWoS and 3D stacking at its 2026 North America Technology Symposium, elevating the role of packaging from "supporting" to "system core."

According to Korean media reports, industry insiders have revealed that Samsung Electronics' 1c DRAM yield has recently reached a significant level, estimated to have exceeded 80%, achieving what is called a "mature yield." However, the industry generally believes that this cannot be directly equated with the mass production yield of HBM4.

According to Aju Daily, Samsung Electronics and SK hynix have decided to sign 3-5 year long-term supply contracts with major global technology companies, moving away from one-year short-term agreements. Samsung Electronics previously stated that it is pushing to convert its supply contracts from annual or quarterly terms to multi-year agreements lasting three to five years, and is expected to stably supply three-year memory products to key customers such as Microsoft and Google. It is said that SK hynix is in discussions with Google regarding a five-year long-term supply contract for general-purpose DRAM in order to maximize supply stability. This move aims to establish a stable, high-margin business model through strategic cooperation with customers in the early stages of AI memory development.

Although since the end of last month, some traders have been offloading existing inventory to accelerate capital turnover, leading to significant corrections in channel memory modules—especially DDR4 products—after the three-day Qingming holiday, the price volatility caused by previous trade selling pressure has gradually subsided. However, market sentiment remains very weak. Clients across various application segments—including channel, embedded, and industrial—still hold certain levels of inventory, and short-term wait-and-see sentiment prevails. As a result, spot memory prices have generally stayed flat this week.

According to South Korean media reports, Samsung Electronics has ordered over 70 lithography machines for PH1, the first phase of the P5 fab cluster at its Pyeongtaek semiconductor production site, in preparation for the operation in 2027. These lithography machines required for Pyeongtaek P5 PH1 are from ASML and Canon, with approximately 20 of them being ASML's EUV exposure systems. P5 PH1 will be used for 1c-nm process DRAM production, manufacturing both general-purpose memory and HBM. Samsung Electronics is expected to begin installing patterning equipment for Pyeongtaek P5 PH1 starting in the second quarter of 2027, at which time the cleanroom construction for this phase will also be completed. The phase is expected to contribute production capacity within 2027, meeting the demands for NVIDIA's "Rubin" and other AI XPUs, and alleviating the current tight supply situation in the DRAM market.

According to foreign media reports, SK Hynix plans to acquire extreme ultraviolet (EUV) lithography equipment valued at approximately 12 trillion won (around 55.4 billion yuan) for the mass production of next-generation DRAM and high-bandwidth memory (HBM). The investment accounts for about 9.97% of SK Hynix’s total assets, with Dutch semiconductor equipment giant ASML as the supplier. The procurement period is expected to run through December 2027.

Samsung Electronics announced it has signed a Memorandum of Understanding (MOU) with AMD to expand their strategic collaboration on next-generation AI memory and computing technologies.Under the MOU, Samsung and AMD will align on primary HBM4 supply for the next-generation AMD AI accelerator, the AMD Instinct MI455X GPU, as well as advanced DRAM solutions for 6th Gen AMD EPYC CPUs, codenamed "Venice". These technologies will support next-generation AI systems combining AMD Instinct GPUs, AMD EPYC CPUs and rack-scale architectures such as the AMD Helios platform. Samsung and AMD will also work together on high-performance DDR5 memory optimized for the 6th Gen AMD EPYC CPUs.

Micron Technology announced financial results for its second quarter of fiscal 2026 (ended February 26, 2026), covering the period from December 2025 to February 2026. Revenue reached $23.86 billion, representing a substantial sequential increase of 75% and a year-over-year surge of 196%. On a non-GAAP basis, operating income was $16.455 billion, with operating margin expanding to 69% from 47% in the prior quarter. Net income reached $14.021 billion, up 156% sequentially and 686% year-over-year.

Kioxia has announced a new category of SSD products, Super High IOPS SSD, which enables the GPU to directly access high-speed flash memory as an expansion to High Bandwidth Memory (HBM) in AI systems. The new Super High IOPS SSD, the KIOXIA GP Series, is purpose-built to meet the growing performance demands of AI and high-performance computing, providing larger GPU-accessible memory capacity for faster data access to AI workloads. Evaluation samples of KIOXIA GP Series will be available to select customers by the end of 2026.

SK hynix memory solutions are designed to minimize data bottlenecks and maximize performance for both AI training and inference in NVIDIA AI infrastructure. Through its participation in GTC 2026, SK hynix plans to demonstrate its competitive edge in memory technology—the core infrastructure of the AI era.

At the NVIDIA GTC 2026 conference, Samsung comprehensively showcased its technological lineup in the AI computing field, exhibiting a full range of products from high-performance memory to low-power solutions for personal devices. Samsung unveiled its next-generation HBM4E memory for the first time. This product achieves a per-pin transfer speed of up to 16Gbps and a bandwidth of up to 4.0 TB/s. Additionally, Samsung demonstrated its Hybrid Copper Bonding (HCB) technology. This new technology will enable next-generation HBM to achieve 16 or more stacked layers while reducing thermal resistance by over 20% compared to thermocompression bonding.

March 16, 2026 (Local Time) — NVIDIA made a major announcement at the 2026 GTC Conference, launching its full-stack AI infrastructure. The core includes three flagship hardware products: the Vera Rubin Platform, Feynman Forward-looking Architecture, and Groq 3 LPU Inference Chip. Simultaneously, it unveiled the NemoClaw Agent Platform and Dynamo AI Factory Operating System, officially declaring that AI has entered a new era of agents and physical AI.

Micron Technology recently announced the completion of its acquisition of the P5 wafer fab from Powerchip Semiconductor Manufacturing Corporation (PSMC) in Tongluo, Miaoli County, Taiwan, China, for a total transaction value of $1.8 billion. The site will serve as a strategic extension of Micron’s large-scale Taichung campus, forming a vertically integrated ecosystem with Micron’s Taichung plant approximately 15 miles away, further strengthening Micron’s industrial presence in the region.