SK Hynix Invests ~12 Trillion Won in EUV Equipment to Strengthen AI Memory Market Position

According to foreign media reports, SK Hynix plans to acquire extreme ultraviolet (EUV) lithography equipment valued at approximately 12 trillion won (around 55.4 billion yuan) for the mass production of next-generation DRAM and high-bandwidth memory (HBM). The investment accounts for about 9.97% of SK Hynix’s total assets, with Dutch semiconductor equipment giant ASML as the supplier. The procurement period is expected to run through December 2027.

EUV equipment is critical for achieving ultra-fine semiconductor processes. Its wavelength (13.5 nm) is roughly one-thirteenth that of conventional argon fluoride (ArF) light sources. As ASML is the sole manufacturer of EUV equipment, the technology barrier is extremely high, with the latest models reportedly costing around 3 billion won each. The large-scale purchase is seen by industry observers as one of SK Hynix’s largest-ever equipment investments in its bid to lead the AI memory market.

Strategically, the investment aligns with SK Hynix’s push to advance its sixth-generation (1c) DRAM process. The company currently uses the 1b process for HBM4 core dies and plans to transition to the 1c process for the next-generation HBM4E products.

On the capacity front, the EUV equipment will be installed at the Cheongju M15X fab and the first fab of the Yongin semiconductor cluster, both currently under construction. Earlier reports indicated that the second clean room at the M15X fab was opened ahead of schedule, with equipment installation starting about two months earlier than originally planned. Meanwhile, the clean room at the first Yongin fab is set to begin operations in February 2027, moved up from the previous target of May 2027.

With AI-driven demand surging, the memory chip market is undergoing a structural shift, and high-performance memory products like HBM remain in tight supply. By securing EUV equipment with this major investment, SK Hynix is addressing current capacity needs while positioning itself for the next battle in next-generation memory technology.