Huawei Mass-Produces 122TB SSDs with Proprietary DoB Packaging

Huawei recently unveiled a new series of high-capacity SSDs based on its proprietary Die-on-Board (DoB) packaging technology. The company has already begun mass production of 61.44TB and 122.88TB models, capable of delivering up to 4.42PB of raw capacity within a 2U rack space, with plans to release a 245TB version in the future. By leveraging its in-house DoB technology, Huawei mounts NAND dies directly onto the PCB. This approach bypasses the chip-count limitations inherent in traditional TSOP or BGA packaging, delivering both higher density and superior performance.