Huawei's Self-Developed DoB Packaging Technology Enables Mass Production of 122TB SSDs

According to media reports, Huawei showcased its high-capacity SSD series based on its self-developed Die-on-Board (DoB) packaging technology at the ID Forum 2026 held in Paris from May 20 to 21. It is reported that the company has already mass-produced 61.44TB and 122.88TB high-capacity SSDs, offering up to 4.42PB of raw capacity in a 2U rack space. The 245TB version is also planned for the future. By utilizing its self-developed DoB technology, Huawei directly mounts more NAND dies onto the PCB, bypassing the die count limitations of traditional TSOP or BGA packaging, thereby achieving higher density and better performance.