Huawei to Unveil New Kirin Mobile Chip This Autumn with First-ever Logic Folding Technology

He Tingbo, President of Huawei Semiconductor Business Dept, stated at ISCAS 2026 that the 2026 Kirin mobile chip will be launched this autumn. It adopts logic folding technology for the first time, marking the first practical application of this technology. The chip features a transistor density of 238 MTr/mm², a 53.5% increase compared with conventional 2D designs. Its performance core sees a 41% efficiency improvement and a 12.7% rise in peak frequency hitting 3.1GHz, breaking the 3GHz threshold for the first time.