TSMC Targets 2029 for Launching Arizona Advanced Packaging Plant, Unveils Advanced Packaging Roadmap

According to Taiwan media reports, TSMC plans to launch its advanced packaging plant in Arizona, US, in 2029 to better serve the needs of American CSP customers, seize high-end packaging orders for AI and HPC, and strengthen its local supply chain presence. 

In addition, TSMC unveiled upgraded roadmaps for CoWoS and 3D stacking at its 2026 North America Technology Symposium, elevating the role of packaging from "supporting" to "system core."

TSMC stated that it is currently mass-producing CoWoS with a 5.5x reticle size, and plans to introduce a 14x reticle size version in 2028, which can integrate approximately 10 compute dies and 20 HBM stacks. TSMC will continue to scale up packaging dimensions and align with SoW-X (System-on-Wafer) technology.