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CFMS | MemoryS
CFMS|MemoryS 2026: Shenzhen, March 27
Persistent Upstream NAND Price Hikes Prompt Memory Makers to Strengthen Cost Control, Driving Most Finished Product Prices to New Highs
Samsung Electronics' 1c DRAM Yield Reportedly Close to 60%
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NVIDIA's Next-Generation AI Chips Enter Mass Production; TSMC's Capacity to Double in the Next Decade
17 hours ago
Industry News
CFMS|MemoryS 2026: Shenzhen, March 27
5 days ago
Industry News
Winbond Electronics: 8Gb DDR4 Now in Shipment, NOR Flash Wafer Starts to Expand to 30K Units by Mid-Year
2026-01-26 10:40 (UTC+0)
Industry News
Samsung Electronics' HBM4E R&D Progress Revealed
2026-01-23 10:44 (UTC+0)
Industry News
Compal: Memory Costs Have Doubled as a Proportion of PC Components
2026-01-23 10:41 (UTC+0)
Industry News
Microsoft Plans to Deploy LPDDR in AI Data Centers
2026-01-22 09:46 (UTC+0)
Industry News
Samsung Plans to Adopt 2nm Process for Custom HBM Logic Chips
2026-01-22 09:42 (UTC+0)
Industry News
Samsung Electronics' 1c DRAM Yield Reportedly Close to 60%
2026-01-16 10:47 (UTC+0)
Industry News
SK Hynix's DRAM production at its Wuxi plant has been upgraded to the 1a process
2026-01-15 08:47 (UTC+0)
Industry News
NVIDIA to Launch GPU R&D Hub in Korea
2026-01-13 08:53 (UTC+0)
Industry News
Intel has officially launched its third-generation Core Ultra processors, codenamed "Panther Lake,"
2026-01-07 11:52 (UTC+0)
Industry News
NVIDIA CEO Jensen Huang stated that the memory chip market represents a completely unserved market
2026-01-07 10:07 (UTC+0)
Industry News
NVIDIA Vera Rubin Enters Full Production, Set to Slash AI Inference Costs by 10-Fold
2026-01-06 02:49 (UTC+0)
Industry News
US ITC Investigates Samsung’s HBM and DDR5 Patent Infringement Claims
2026-01-05 07:13 (UTC+0)
Industry News
HOSIN Global Submits Listing Application to HKEX: H1-H3 2025 Revenue Hits $10.69 Billion, Inventory Exceeds $7.10 Billion
2026-01-04 09:26 (UTC+0)
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15 hours ago
Samsung Plans to Increase Investment in Advanced NAND Flash Memory in Q2
15 hours ago
Intel Launches new Xeon 600 Processors for Workstation with Support for Higher Memory Speeds
15 hours ago
Winbond: Memory Production Capacity for 2026 and 2027 Have Been Fully Sold and Booked
15 hours ago
SoftBank Corp. Subsidiary SAIMEMORY and Intel Cooperates with Intel to Commercialize ZAM Memory
15 hours ago
Google Cloud and Liberty Global Announce Five-Year Strategic Partnership
15 hours ago
Maxio Technology 2025 Revenue Hits 1.33B Yuan, Up 13.42% YoY
16 hours ago
Storage Industry IPOs Accelerate: Multiple Companies File for Hong Kong and A-Share Listings
17 hours ago
Jensen Huang predicts TSMC's production capacity will double in the next decade.
22 hours ago
TSMC's 2nm capacity fully booked, multiple tech giants finalize production schedules
1 day ago
Huawei Tops Chinese Smartphone Market in January, Mate 80 Series Sales Exceed 2.54 Million Units
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Maxio Technology 2025 Revenue Hits 1.331B Yuan, Up 13.42% YoY
Samsung Resumes Investment in NAND Flash Production Line at Pyeongtaek Plant
Kioxia and Sandisk Extend Yokkaichi Joint Venture Agreement Through 2034
Kioxia Introduces QLC UFS 4.1 Embedded Flash Memory Devices for High-Capacity Mobile Storage
CFMS|MemoryS 2026: Shenzhen, March 27
SK hynix Announces FY25 Financial Results
Persistent Supply Shortages Keep NAND Resource Costs Elevated, Driving Continued Price Increases Across OEM, Channel, and Embedded Products