MediaTek's First-Gen ASIC Enters Volume Production in Q4, Adopts Intel EMIB-T Advanced Packaging

During MediaTek's earnings call, the company emphasized that its first-generation datacenter ASIC will enter volume production as scheduled in the fourth quarter of 2026, and is expected to generate $2 billion in revenue. Meanwhile, the company has raised its 2027 serviceable addressable market (SAM) estimate to $80 billion, and has revised its ASIC market share target upward from 10%–15% to 15%–20%. In addition, MediaTek revealed that for its AI ASIC (custom chips), it will not only adopt TSMC's CoWoS packaging but also integrate Intel's EMIB-T advanced packaging technology to address the diverse large-scale AI chip design requirements of different customers.