CXMT Reportedly Launches Equipment Tender for New Shanghai Fab, Long-Term Total Capacity Expected to Reach 600,000 Wafers Per Month

According to industry sources, CXMT has recently launched a tender process to select partners for introducing equipment into its new Shanghai factory.

CXMT is currently mass-producing DRAM at its Phase II facility in Hefei and Phase I facility in Beijing. Current capacity is estimated at over 200,000 wafers per month, and is expected to exceed 300,000 wafers per month by the end of the year.

It is reported that CXMT plans to launch a new wafer fab project in Hefei in the first half of 2027, and to establish a new wafer production line in Beijing as early as the second half of 2027, continuing to advance its DRAM capacity expansion. If all facility investment plans are executed smoothly, CXMT is expected to steadily secure at least 70,000 to 80,000 wafers of new capacity annually from this year through 2028. In the long term, total capacity is projected to expand to more than 600,000 wafers per month.

According to data from CFM, CXMT's DRAM sales revenue in the second quarter reached $14.545 billion, a 99% quarter-on-quarter increase. Its market share has approached 10%, ranking fourth, primarily driven by the fact that price increases for mobile LP4X/5X products—which account for the largest share of its supply—have led gains across all other application markets, resulting in the highest quarter-on-quarter growth rate in DRAM sales revenue.