According to media reports citing industry sources, CXMT has recently launched bidding to bring in equipment partners for its new plant in Shanghai. CXMT is currently mass-producing DRAM at its Hefei Phase 2 plant and Beijing Phase 1 plant, with current capacity estimated at more than 200,000 wafers per month, and is expected to exceed 300,000 wafers per month by the end of the year. It is said that CXMT will open a new wafer fab in Hefei in the first half of next year and another new wafer fab in Beijing as early as the second half of next year. If all facility investment plans are executed smoothly, CXMT is expected to reliably secure at least 70,000 to 80,000 wafers of new capacity per year from this year to 2028. In the long term, capacity is expected to expand to more than 600,000 wafers per month.