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CFMS | MemoryS
2025-2026 Global Memory Market Trend White Paper
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
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Google TPU8 Splits Training and Inference, Pioneering a Fine-Grained Paradigm for AI Memory
2026-06-04 10:10 (UTC+0)
Technical
Intrinsic Ferroelectricity Confirmed in Gallium Oxide at Room Temperature, Paving Way for High-Power Memory Integration
2026-03-02 06:30 (UTC+0)
Technical
NVIDIA Partners with Global Operators to Define AI-Native 6G, with Storage as a Key Foundation
2026-03-02 03:09 (UTC+0)
Technical
AMD Zen 6 Leaks: The number of cores increases while the area remains almost unchanged.
2026-02-02 06:05 (UTC+0)
Technical
JEDEC Adds Two New Standards Supporting CXL Technology
2024-09-24 07:53 (UTC+0)
Technical
JEDEC Updates DDR5 Specification for Increased Security Against Rowhammer Attacks, New DDR5-8800 Reference Speed
2024-04-24 09:32 (UTC+0)
Technical
SD Application Specifications Formats
2009-12-26 09:50 (UTC+0)
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SDIO
2009-12-26 09:48 (UTC+0)
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SD Host Controller
2009-12-26 09:45 (UTC+0)
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SD Speed Class
2009-12-26 09:41 (UTC+0)
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SDXC
2009-12-26 09:40 (UTC+0)
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microSDHC
2009-12-26 09:37 (UTC+0)
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miniSDHC
2009-12-26 09:33 (UTC+0)
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SD High-Capacity Cards
2009-12-26 09:32 (UTC+0)
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microSD Card
2009-12-26 09:29 (UTC+0)
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Newsflash
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3 days ago
Samsung Reportedly to Begin Initial Mass Production of 10nm 7th-Gen 1d DRAM by End of Next Year
3 days ago
Jeju Semiconductor's LPDDR5 Reportedly to Be Produced at SK hynix's Wuxi Plant
3 days ago
OpenAI Reportedly Spent $34 Billion Last Year, 2.6 Times Its Revenue
3 days ago
Intel's 18A‑P Process Enters Risk Production Phase
3 days ago
ENF Reportedly Supplies Key Semiconductor Material HF to SK hynix for the First Time
4 days ago
AMD Acquires MEXT to Alleviate Increasingly Prominent Memory Bottlenecks in Data Centers
4 days ago
Applied Materials Unveils Two "3D Scaling" Systems Tailored for High-Stack Memory Chip Production
4 days ago
NVIDIA to Raise $25 Billion in First Corporate Bond Sale in Five Years
4 days ago
FADU Reportedly Delays eSSD Controller Supply at Customer Request
4 days ago
Li Auto Unveils M100 SoC, Featuring 8 LPDDR5X Subsystems
Hot News
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Notice of 2026 Dragon Boat Festival Holiday
Apacer Launches GraTherX Thermal Solution, Reducing DDR5 Temperatures by Up to 23.4°C
Reports: SK Hynix May Supply HBM4E Samples as Early as This Month
375 Layers! SK Hynix to Mass-Produce Next-Gen NAND by Year-End
Prices of Low-Capacity DDR5 UDIMM See a Slight Rebound, but Quarter-End Performance Pressures May Cause Continued Market Volatility
Biwin Locks in Volume and Price with a $1.86 Billion Purchase of Enterprise Flash Chips
Samsung Electronics' Foundry Division Expected to Turn Profitable in Q3
