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CFMS | MemoryS
【CFM Research】Memory Prices to Rise Further in the Second Half of the Year
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
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Weekly Review
Google TPU8 Splits Training and Inference, Pioneering a Fine-Grained Paradigm for AI Memory
2026-06-04 10:10 (UTC+0)
Technical
Intrinsic Ferroelectricity Confirmed in Gallium Oxide at Room Temperature, Paving Way for High-Power Memory Integration
2026-03-02 06:30 (UTC+0)
Technical
NVIDIA Partners with Global Operators to Define AI-Native 6G, with Storage as a Key Foundation
2026-03-02 03:09 (UTC+0)
Technical
AMD Zen 6 Leaks: The number of cores increases while the area remains almost unchanged.
2026-02-02 06:05 (UTC+0)
Technical
JEDEC Adds Two New Standards Supporting CXL Technology
2024-09-24 07:53 (UTC+0)
Technical
JEDEC Updates DDR5 Specification for Increased Security Against Rowhammer Attacks, New DDR5-8800 Reference Speed
2024-04-24 09:32 (UTC+0)
Technical
SD Application Specifications Formats
2009-12-26 09:50 (UTC+0)
Technical
SDIO
2009-12-26 09:48 (UTC+0)
Technical
SD Host Controller
2009-12-26 09:45 (UTC+0)
Technical
SD Speed Class
2009-12-26 09:41 (UTC+0)
Technical
SDXC
2009-12-26 09:40 (UTC+0)
Technical
microSDHC
2009-12-26 09:37 (UTC+0)
Technical
miniSDHC
2009-12-26 09:33 (UTC+0)
Technical
SD High-Capacity Cards
2009-12-26 09:32 (UTC+0)
Technical
microSD Card
2009-12-26 09:29 (UTC+0)
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Newsflash
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23 hours ago
Macronix July Revenue Breaks NT$7 Billion Barrier, Hits New Monthly Record
23 hours ago
Winbond Electronics: July Revenue Reached NT$26.773 Billion, Up 30% Month-on-Month
1 day ago
NVIDIA Reportedly Developing Technology to Let SSDs Serve as Extra VRAM
1 day ago
Winbond: Kaohsiung Module A Monthly Capacity to Expand to 24,000 Wafers, Module B Expansion Plan Initiated
1 day ago
Adata's July Revenue Hits Another Record High, Soaring 331.3% YoY
1 day ago
Adata: Memory Price Uptrend to Continue Through 1H27, DRAM Supply to Tighten Further in 2027
1 day ago
AMD Announces Acquisition of AI Inference Chip Startup Taalas
1 day ago
SK Hynix Invests $38 Billion to Build New DRAM and NAND Flash Facilities
2 days ago
CoreWeave and Solidigm Sign Multi-Year Agreement to Strengthen Integrated AI Cloud Platform
2 days ago
SanDisk: Minimum Expected Revenue from Signed Agreements Stands at $93.9 Billion, with Actual Revenue Expected to Exceed This Amount
Hot News
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SK hynix Invests 54 Trillion Won in Yongin Y2 and Cheongju M17 to Secure Mid-to-Long-Term Production Base for AI Memory Demand
CFM: Soaring Memory Costs Suppress End-User Demand; Consumer-Grade NAND Market Faces Pressure in Q4
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND
64GB eMMC Prices Fall Again This Week Amid Trading Market Inventory Backlog and Short-Term Digestion Challenges
CFM: Divergence in Server Customers' Price Acceptance for eSSDs; Q3 Price Hikes by Memory Original Manufacturers Range from 10% to 30%
SK hynix Unveils First HBF Standard Specifications with Sandisk
Samsung Electronics: 70% of Memory Capacity Locked by LTAs; HBM Shortfall Expected to Widen Further Next Year