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CFMS | MemoryS
CFMS｜MemoryS 2026: Shenzhen, March 27
Persistent Upstream NAND Price Hikes Prompt Memory Makers to Strengthen Cost Control, Driving Most Finished Product Prices to New Highs
Samsung Electronics' 1c DRAM Yield Reportedly Close to 60%
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AMD Zen 6 Leaks: The number of cores increases while the area remains almost unchanged.
1 day ago
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JEDEC Adds Two New Standards Supporting CXL Technology
2024-09-24 07:53 (UTC+0)
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JEDEC Updates DDR5 Specification for Increased Security Against Rowhammer Attacks, New DDR5-8800 Reference Speed
2024-04-24 09:32 (UTC+0)
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28 minutes ago
Reports indicate that SK Hynix Plans to Increase Investment in Cutting-Edge NAND in Q2
16 hours ago
Samsung Plans to Increase Investment in Advanced NAND Flash in Q2
16 hours ago
Intel Launches new Xeon 600 Processors for Workstation with Support for Higher Memory Speeds
17 hours ago
Winbond: Memory Production Capacity for 2026 and 2027 Have Been Fully Sold and Booked
17 hours ago
SoftBank Corp. Subsidiary SAIMEMORY and Intel Cooperates with Intel to Commercialize ZAM Memory
17 hours ago
Google Cloud and Liberty Global Announce Five-Year Strategic Partnership
17 hours ago
Maxio Technology 2025 Revenue Hits 1.33B Yuan, Up 13.42% YoY
18 hours ago
Storage Industry IPOs Accelerate: Multiple Companies File for Hong Kong and A-Share Listings
19 hours ago
Jensen Huang predicts TSMC's production capacity will double in the next decade.
1 day ago
TSMC's 2nm capacity fully booked, multiple tech giants finalize production schedules
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Maxio Technology 2025 Revenue Hits 1.331B Yuan, Up 13.42% YoY
Samsung Resumes Investment in NAND Flash Production Line at Pyeongtaek Plant
Kioxia and Sandisk Extend Yokkaichi Joint Venture Agreement Through 2034
Kioxia Introduces QLC UFS 4.1 Embedded Flash Memory Devices for High-Capacity Mobile Storage
CFMS｜MemoryS 2026: Shenzhen, March 27
SK hynix Announces FY25 Financial Results
Persistent Supply Shortages Keep NAND Resource Costs Elevated, Driving Continued Price Increases Across OEM, Channel, and Embedded Products
