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CFMS | MemoryS
【CFM Research】Memory Prices to Rise Further in the Second Half of the Year
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
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Weekly Review
Google TPU8 Splits Training and Inference, Pioneering a Fine-Grained Paradigm for AI Memory
2026-06-04 10:10 (UTC+0)
Technical
Intrinsic Ferroelectricity Confirmed in Gallium Oxide at Room Temperature, Paving Way for High-Power Memory Integration
2026-03-02 06:30 (UTC+0)
Technical
NVIDIA Partners with Global Operators to Define AI-Native 6G, with Storage as a Key Foundation
2026-03-02 03:09 (UTC+0)
Technical
AMD Zen 6 Leaks: The number of cores increases while the area remains almost unchanged.
2026-02-02 06:05 (UTC+0)
Technical
JEDEC Adds Two New Standards Supporting CXL Technology
2024-09-24 07:53 (UTC+0)
Technical
JEDEC Updates DDR5 Specification for Increased Security Against Rowhammer Attacks, New DDR5-8800 Reference Speed
2024-04-24 09:32 (UTC+0)
Technical
SD Application Specifications Formats
2009-12-26 09:50 (UTC+0)
Technical
SDIO
2009-12-26 09:48 (UTC+0)
Technical
SD Host Controller
2009-12-26 09:45 (UTC+0)
Technical
SD Speed Class
2009-12-26 09:41 (UTC+0)
Technical
SDXC
2009-12-26 09:40 (UTC+0)
Technical
microSDHC
2009-12-26 09:37 (UTC+0)
Technical
miniSDHC
2009-12-26 09:33 (UTC+0)
Technical
SD High-Capacity Cards
2009-12-26 09:32 (UTC+0)
Technical
microSD Card
2009-12-26 09:29 (UTC+0)
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Newsflash
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2 days ago
Samsung Said to Launch Galaxy Z TriFold2 Ahead of Schedule
2 days ago
SK hynix Reportedly Unveils New Solutions Including PIM, HBF, and SALT-KV at AI Infra Summit
2 days ago
AMD Reportedly Plans Price Increase for Products Amid TSMC Foundry Price Hikes in Q4
3 days ago
Micron's India Chip Output Reportedly Jumps to Hundreds of Millions in 2027
3 days ago
Nebius Said to Raise Prices for its On-demand Compute Resources Starting October
3 days ago
Intel's 14A Process Reportedly Moves Up to Trial Production in 1Q27
3 days ago
ADATA Reportedly Spends $125 Million to Build AI Computing Capacity in Malaysia
3 days ago
OpenAI Reportedly Targets $1.5 Trillion Valuation as it Weighs Pre-IPO Funding
4 days ago
Micron Unveils the World's First Ultra-Dense Module for Next-Generation Servers
4 days ago
Meta Reportedly Plans to Deploy Custom Chips in Data Centers in 2027
Hot News
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Solidigm Considers Building First U.S. NAND Flash Production Base Amid Surging AI Demand
Huawei AI Chips Accelerate: Ascend 960 Series to Launch Early with Doubled Performance
Shifting to a “Dual-Track” Model? Reports Indicate Samsung Electronics’ HBM Base Die Supply Strategy is Changing
Samsung Shifts DDR5/SSD Production to Outsourcing, Focuses In-House Capacity on HBM
Micron Unveils the World's First Ultra-Dense Module for Next-Generation Servers, Volume Production Expected in 2H2027
Resource Prices Hit Historic Highs,Industrial DDR5 Modules See Slight Uptick This Week Amid Rising Costs
CXMT Reportedly Launches Equipment Tender for New Shanghai Fab, Long-Term Total Capacity Expected to Reach 600,000 Wafers Per Month
