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CFMS | MemoryS
【CFM Research】Memory Prices to Rise Further in the Second Half of the Year
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
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Weekly Review
Google TPU8 Splits Training and Inference, Pioneering a Fine-Grained Paradigm for AI Memory
2026-06-04 10:10 (UTC+0)
Technical
Intrinsic Ferroelectricity Confirmed in Gallium Oxide at Room Temperature, Paving Way for High-Power Memory Integration
2026-03-02 06:30 (UTC+0)
Technical
NVIDIA Partners with Global Operators to Define AI-Native 6G, with Storage as a Key Foundation
2026-03-02 03:09 (UTC+0)
Technical
AMD Zen 6 Leaks: The number of cores increases while the area remains almost unchanged.
2026-02-02 06:05 (UTC+0)
Technical
JEDEC Adds Two New Standards Supporting CXL Technology
2024-09-24 07:53 (UTC+0)
Technical
JEDEC Updates DDR5 Specification for Increased Security Against Rowhammer Attacks, New DDR5-8800 Reference Speed
2024-04-24 09:32 (UTC+0)
Technical
SD Application Specifications Formats
2009-12-26 09:50 (UTC+0)
Technical
SDIO
2009-12-26 09:48 (UTC+0)
Technical
SD Host Controller
2009-12-26 09:45 (UTC+0)
Technical
SD Speed Class
2009-12-26 09:41 (UTC+0)
Technical
SDXC
2009-12-26 09:40 (UTC+0)
Technical
microSDHC
2009-12-26 09:37 (UTC+0)
Technical
miniSDHC
2009-12-26 09:33 (UTC+0)
Technical
SD High-Capacity Cards
2009-12-26 09:32 (UTC+0)
Technical
microSD Card
2009-12-26 09:29 (UTC+0)
Technical
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Newsflash
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10 hours ago
Samsung Unveils zHBM, zNAND-O Concept Models and 400+ Layer V10 BV-NAND
1 day ago
CXMT Reportedly Plans New Plant in Beijing
1 day ago
CFM: Price Acceptance for Server eSSDs Diverges Among Customers; Q3 Price Hikes Across Vendors Range from 10% to 30%
1 day ago
SK hynix Unveils First HBF Standard Specifications with Sandisk
2 days ago
Samsung Foundry Reportedly Targets 100% Capacity Utilization in H2, Expected to Return to Profit in Q3
2 days ago
Xiaomi Raises Prices on Multiple Smartphone by RMB 300–500
2 days ago
MediaTek's First-Gen ASIC Enters Volume Production in Q4, Adopts Intel EMIB-T Advanced Packaging
2 days ago
Alibaba Launches Qwen3.8-Max Model
2 days ago
CXMT LPDDR6 Reportedly Nears Final R&D Validation, Mass Production Expected in H2
5 days ago
MediaTek Q2 Revenue Edges Up 1.2% YoY, Net Profit Falls 12.6% YoY
Hot News
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CFM: Soaring Memory Costs Suppress End-User Demand; Consumer-Grade NAND Market Faces Downward Pressure in Q4
New 3D Flash Memory Technology from Kioxia and Sandisk Achieves Industry’s Highest Bit Density for QLC NAND
64GB eMMC Prices Fall Again This Week Amid Trading Market Inventory Backlog and Short-Term Digestion Challenges
CFM: Divergence in Server Customers' Price Acceptance for eSSDs; Q3 Price Hikes by Memory Original Manufacturers Range from 10% to 30%
SK hynix Unveils First HBF Standard Specifications with Sandisk
Samsung Electronics: 70% of Memory Capacity Locked by LTAs; HBM Shortfall Expected to Widen Further Next Year
Kioxia Commences Sample Shipments of 9th-Generation BiCS FLASH™ 1Tb TLC Devices
