At Computex 2024, held from June 4-7 in Taipei, SK hynix demonstrated its latest advancements in AI memory solutions under the theme "Memory, The Power of AI." The company highlighted its innovative products, including AI server solutions, cutting-edge memory technologies for on-device AI PCs, and consumer-grade SSDs.

The Korean government has initiated a review of policy support, including tax benefits, for materials, parts, and equipment essential for High Bandwidth Memory (HBM) chip manufacturing. This move aims to bolster the country's semiconductor industry, a critical pillar of its economy.

Samsung Electronics has recently announced that hybrid bonding technology is essential for High Bandwidth Memory (HBM) starting from 16 stacks, marking a significant milestone in semiconductor storage technology. This move is expected to propel the development of high-performance computing and artificial intelligence sectors.

Micron Technology, Inc. has announced the sampling of its cutting-edge GDDR7 graphics memory, featuring the industry's highest bit density. The new GDDR7 leverages Micron's 1β (1-beta) DRAM technology and an innovative architecture to deliver high-performance memory at 32 Gb/s within a power-optimized design. Boasting a system bandwidth of over 1.5 TB/s, the GDDR7 offers up to a 60% increase in bandwidth over GDDR6, along with four independent channels for optimized workloads, enabling faster response times and smoother gameplay.

Ryu Byung-hoon, vice president of future strategy at SK hynix, has emphasized the need for cautious investment in High Bandwidth Memory (HBM).

Rubin is likely to use 12-stack HBM4 as its memory. SK Hynix is planning to start mass production of the Gen 6 HBM in 2025.

Hanwha Precision Machinery has won a deal with SK Hynix to supply thermal compression (TC) bonders used in the production of high-bandwidth memory (HBM), TheElec has learned.

The reason China has become the country’s largest export destination again is due to the increase in exports of intermediate goods such as semiconductors to China, which serves as the world's factory amid a favorable global IT market.

PSK Holdings is a supplier of reflow and descum equipment used in HBM production for Samsung and SK Hynix.

According to industry sources on May 28, the domestic semiconductor materials company ENF Technology has developed titanium etchant (Ti etchant) using its own technology and has started supplying this material to the world’s largest HBM manufacturer.

SK hynix has announced that the yield (ratio of good chips) of their fifth-generation High Bandwidth Memory (HBM) HBM3E is nearing 80%.

Samsung Electronics and SK hynix have significantly increased their research and development (R&D) and facility investments in the first quarter of this year. Samsung Electronics reported its highest first-quarter R&D investment ever.

On May 14, at a European technology symposium held in Amsterdam, the Netherlands, TSMC unveiled details about its sixth-generation HBM4 for the first time. TSMC disclosed that it is considering 12-nanometer (nm) and 5-nm processes for the production of logic dies that will be used in HBM4, effectively offering to customize and supply HBM4 based on client performance requirements.

SK Hynix is planning to start mass production of HBM4E in 2026, a company research said.

In an impressive display of economic resilience, the Korea Information and Communication Technology (ICT) industry recorded a growth rate in exports over 30% for the first time since March 2022 fueled by strong performances in key segments such as semiconductors.