Samsung Electronics has conducted an organizational restructuring, dissolving the High Bandwidth Memory (HBM) development team that was established last year and reorganizing it under the DRAM development division.

The DDR5 product lineup features peak speed of 8000 Mbps and die density up to 24Gb. Multiple DDR5 modules products also met the public, including UDIMM、SODIMM、CUDIMM、CSODIMM、RDIMM、MRDIMM、TFF MRDIMM.

Samsung Electronics has announced the completion of its regular 2026 executive personnel adjustments, which included the promotion of 161 executives to positions such as EVP, VP, Fellow, and Master. This represents a significant increase compared to last year's 137 promotions.

Looking back at November, the overall spot market for Memory maintained a strong upward trend. Even though the prices of finished products were high, customers with low inventory levels were in urgent need of replenishing inventory and had gradually accepted the newly agreed prices.

Samsung Electronics today announced that TM Roh was officially named Head of Device eXperience (DX) Division and appointed as CEO, joining Young Hyun Jun, Vice Chairman and Head of Device Solutions (DS) Division, as co-CEOs of the Company.

Since the third quarter, Memory manufacturers have successively controlled resource supply and slowed down the shipping rhythm. Even the supply of some DRAM resources has been put on hold. In a blink of an eye, as we enter the second half of the last quarter of this year, with the upstream supply showing no signs of improvement and the market continuously depleting inventory, the contradiction between supply and demand for Memory in the spot market has become more and more intense, further strengthening the mentality of Memory suppliers to control goods and be reluctant to sell.

Driven by the sharp increase in NAND costs, prices for embedded eMMC/UFS have also been raised significantly. Currently, major suppliers continue to maintain tight shipment strategies, and a significant improvement in resource supply is unlikely in the short term. Embedded Memory prices are therefore expected to maintain their upward trend. In the mainstream market, end-products that cannot bear such high cost pressures may face being phased out.

Winbond Electronics expressed optimism about its growth prospects for the fourth quarter of 2025 and the long term, anticipating significant improvements in revenue, shipment volume, and average selling price (ASP), with a return to a normal growth trajectory.

Benefiting from the significantly improved price environment of the NAND and DRAM product lines in the third quarter, and in response to the strong new demand for server NAND and DRAM, the sales of high - value - added products such as server DDR5, LPDDR5X, HBM3E, and eSSD have been expanded.

The PM9E1 is Samsung Electronics’ industry-leading PC SSD in terms of performance and capacity, with sequential read and write speeds of up to 14.5 gigabytes (GB) per second.

Currently, the focus of the Memory market mainly revolves around the actual implementation of supply and pricing by Memory manufacturers. Although Memory manufacturers recently announced the temporary quotations of some products, it still takes some time to promote the substantive negotiations between the supply and demand sides.

Driven by supply control at the resource end and trade speculation, the spot prices of 512Gb/1Tb Flash Wafers have been rising continuously for nearly two months, with a cumulative increase of over 20%.

Samsung Electronics presented a target pin speed of over 13Gbps for HBM4E, which is under development for 2027. HBM4E has 2,048 pins for data transfer, which translates to 3.25TB/s when converted to bytes (1 byte equals 8 bits). Simultaneously, Samsung Electronics stated that the power efficiency of HBM4E would be more than twice that of the current HBM3E, which is 3.9 picojoules (pJ) per bit.

Since last month, driven by both supply control and price hikes from Memory manufacturers, the prices of spot Flash Wafers have increased strongly.

Production capacity at Fab2 will ramp up in stages over time, in line with market trends, with meaningful output expected to begin in the first half of 2026.