SK Hynix, a leading memory chip manufacturer, has received indications from the seven major technology companies in the US stock market, collectively known as the Magnificent 7 (M7), expressing their desire for customized high-bandwidth memory (HBM) solutions. The company's VP in charge of HBM business, Ryu Seong-soo, announced this at the 2024 Cheongju Forum held by SK Group, outlining SK Hynix's strategy to leverage these opportunities for the development of its memory business amidst the growing demand for AI and high-performance computing solutions.

AI server demand pushes enterprise SSD prices up 80%; SK Hynix and Solidigm target market leadership by expanding production of high-capacity enterprise SSDs

ADATA Technology, a leading memory module manufacturer, anticipates a rise in memory prices and remains optimistic about the DRAM supply and demand dynamics. The company plans to maintain a conservative inventory policy, focusing on profit margin enhancement as the primary goal for the year.

Despite a sluggish market for EVs and smartphones, Japanese semiconductor equipment manufacturers have reported an 80% increase in operating profits for the second quarter, thanks to robust demand from the AI sector.

Samsung Electronics has confirmed plans to introduce DRAM processing equipment at its P4 facility, with full-scale construction underway. The company aims to commence operations in June next year, focusing on the production of the 6th generation 1c process DRAM, which is yet to be commercialized.

SK Hynix's CEO, Lucas Cho, has stated that the memory chip market will maintain its optimistic outlook for some time, driven by strong demand for high-performance memory chips like HBM, and is expected to stay active until the beginning of next year.

AMD has reported Q2 2024 revenue of $5.8 billion, a 9% increase YoY, with a gross margin of 49% and net income of $265 million. The company's data center business has achieved a record quarterly revenue of $2.8 billion, marking a significant 115% YoY growth, driven by robust sales of the Instinct MI300 GPU and the 4th Gen EPYC CPU. Despite the decrease in semi-custom and embedded business revenue, AMD's AI revenue has surpassed $1 billion, and the company has raised its full-year AI revenue projection to $4.5 billion.

Samsung Electronics is gearing up for the mass production of its fifth-generation High Bandwidth Memory (HBM) chips, the HBM3e, anticipating a significant boost in revenue contribution by year-end.

Samsung Electronics is reportedly adjusting its high bandwidth memory (HBM) production strategy, planning to outsource the assembly and testing process of HBM to its subsidiary STeco. This decision aims to address the shortage of cleanroom space in the backend process and improve STeco's profitability.

In its Q2 earnings report, SK Hynix announced that High Bandwidth Memory (HBM) sales for the year are expected to surge by 300% compared to last year, and it anticipates that shipments in the following year will more than double. The company has completed discussions with key customers regarding HBM production for the next year, indicating that they have received orders and are preparing for production and shipment.

South Korean chipmaker SK Hynix has announced a board resolution to invest approximately 9.4 trillion won (about $67.8 billion) in the construction of the first fabrication facility and business premises of the Yongin Semiconductor Cluster in South Korea. The company aims to start construction in March next year, with completion expected in May 2027, to meet the growing demand for AI-driven semiconductor memory solutions.

SK Hynix has reported its financial results for the second quarter of 2024, achieving a historic high in combined revenue driven by robust demand for HBM and eSSD products tailored for AI applications. The company's HBM sales surged by over 80% quarter-on-quarter, significantly contributing to the overall performance.

Hanmi Semiconductor is set to invest 30 billion KRW (approximately 21.63 million USD) to purchase a 10,000 pyeong (approximately 33 acres) factory site in Juwang National Industrial Park, Incheon, South Korea, adjacent to its third factory. The company plans to commence construction in early next year with completion expected by year-end, focusing on the production of TC bonding machines, which are crucial for High Bandwidth Memory (HBM) bonding. With the new facility, Hanmi aims to become the world's largest supplier of TC bonding machines, increasing its annual production capacity to 420 units by 2025.

The 4 nm node is Samsung’s signature chip foundry manufacturing process with a yield of more than 70%. The company uses the process for the Exynos 2400 chipset, the brain of its flagship AI smartphone Galaxy S24 series.

OPENEDGES Technology, Inc the leading provider of memory subsystem IP, is pleased to announce that its subsidiary, The Six Semiconductor Inc (TSS), has successfully brought-up and validated its HBM3 testchip in 7 nm process technology. The IP validation testchip and the HBM3 PHY were brought up within the first month to 6.4 Gbps, and further tuning has resulted in successful operation of the HBM3 memory subsystem overclocked to 7.2 Gbps.