Micron Technology, Inc. announced a market segment-based reorganization of its business units to capitalize on the transformative growth driven by AI, from data centers to edge devices.

SK Hynix’s semiconductor plants in Icheon City, Gyeonggi Province, and Cheongju City, Chungbuk Province achieved an impressive export value of approximately 8.2783 trillion won (approximately $5.7 billion) in the first quarter according to the Korea Customs Service on April 15.

SK hynix Inc. has shipped 12-layer HBM4 samples to major customers, accelerating competition in the next-generation artificial intelligence (AI) semiconductor market.

Micron’s HBM advanced packaging investment of approximately US $7 billion (SG$9.5 billion) .

In addition to advancements in custom chip design, significant changes are also occurring in the memory market.

SK Hynix will now surely adjust its DRAM production capacity projection as it now suppliers HBM to both Nvidia and Broadcom. It is currently supplies the majority of HBM used by Nvidia for their AI accelerators.

Samsung Electronics has embarked on establishing a test line to improve the yield of its 7th generation (1d) DRAM, a memory two generations ahead, at the 10nm (nanometer, one billionth of a meter) level.

Executive vice president Ahn Hyun was promoted to president and the new post of chief development officer (CDO).

Samsung Electronics is expected to supply its cutting-edge chips to the top graphics processing unit maker Nvidia soon, stepping closer to securing a footing in the lucrative AI chip market.

The HBM4 chip could also be used in Tesla’s AI data centers under development and its self-driving cars, which are currently fitted with HBM2E chips for pilot programs.

According to industry sources on Nov. 19, Samsung Electronics signed a contract in the third quarter to sell and purchase semiconductor equipment for the purpose of expanding production facilities at its Suzhou plant (SESS) in China. The contract is valued at approximately 20 billion won.

The new facilities, expected to be completed by December 2027, will feature advanced packaging lines for HBM chips, which are in high demand due to their essential role in AI computing.

Kwak also said that the company will push Gen 6 HBM, or HBM4, in 12 stacks and 16 stacks as their main products.

Samsung Electronics' R&D investment in the third quarter of 2024 was 8.87 trillion Korean won, an increase of 9.24% compared to the previous quarter. In terms of DRAM, Samsung Electronics plans to expand sales in the fourth quarter in conjunction with HBM production capacity, accelerate the transition of server DDR5 to 1nm, and actively increase the sales proportion of 32Gb DDR5 high-density products. In terms of NAND, we will expand sales of PCIe Gen5 based on the eighth generation (V8) and plan to mass produce QLC NAND 64TB products with high growth potential.

HBM has become SK Hynix's largest growth engine and core business. HBM accounted for over 30% of SK Hynix's total DRAM sales in the third quarter, and is expected to reach 40% in the fourth quarter.