South Korea is set to invest 274.4 billion won, equivalent to approximately $200 million, in a national-level semiconductor packaging technology research and development project. This strategic move aims to develop key technologies for high-performance, low-power chips necessary for artificial intelligence applications and to narrow the gap in the semiconductor back-end process market where South Korea currently holds less than 10% of the market share.

SK hynix reported that the manufacturing yield of the 3D DRAM, stacked in five layers, recorded 56.1%.

Taiwan Semiconductor Manufacturing Company (TSMC), in collaboration with its subsidiary Creative Electronics, has reportedly won a significant order for the next-generation HBM4 interface chips from SK Hynix. This partnership highlights TSMC's advanced chip manufacturing capabilities and signals its expansion into the HBM4 and advanced packaging technology markets.

Samsung Electronics is set to resume the foundational construction of its new semiconductor factory, P5, in Pyeongtaek, as the semiconductor industry begins to recover. The decision comes in response to the rapidly growing demand for storage semiconductors, particularly driven by the AI boom. With the construction of P5 expected to provide significant production capacity for both memory and system semiconductors, the factory's completion is anticipated to be in April 2027, subject to market conditions.

Transcend, a prominent memory product manufacturer, has shared its market outlook during its shareholders' meeting, projecting a sustained high inventory value of 5 billion New Taiwan Dollars and gross margins expected to exceed 30%. The company attributes this to the upcoming launch of AI PC products, which will significantly boost demand in the channel market, and the potential for increased sales in the industrial application sector.

Samsung Electronics' memory semiconductor division has unveiled plans for an organizational restructuring in the second half of the year, signaling a potential breakthrough in core businesses such as High Bandwidth Memory (HBM). The announcement was made during a town hall meeting led by the new head of the Device Solutions (DS) division, emphasizing the importance of synergy and streamlining within the company.

Driven by the global surge in AI technology, Micron Technology is actively expanding its High Bandwidth Memory (HBM) production capabilities worldwide. According to Nikkei Asia, Micron aims to rapidly increase its market share in the HBM sector to approximately 20% by 2025, aligning with its overall revenue share in the DRAM industry.

The global semiconductor industry is on track for significant capacity expansion, with the Semiconductor Equipment and Materials International (SEMI) reporting an expected increase of 6% in 2024 and 7% in 2025, setting new records for manufacturing capacity. This surge is primarily driven by the application of artificial intelligence (AI) in data centers and advanced devices, with a projected 13% growth in 5-nanometer and below process technologies in 2024.

Samsung Electronics is set to revolutionize the high bandwidth memory (HBM) market with the introduction of a 3D packaging service for HBM chips, expected to be utilized in the upcoming HBM4 generation in 2025. This advancement marks a significant step in the evolution of chip packaging technology, with potential implications for the burgeoning AI chip industry.

SK Hynix is fully committed to expanding its 5th generation (1b) 10nm DRAM production to meet the growing demand for next-generation high bandwidth memory (HBM). The company plans to increase its monthly production capacity to 90,000 wafers by the end of this year, a 20,000 wafer increase compared to last year's plan. The industry anticipates that the strong demand for HBM could lead to further expansion of the production increase.

QLC technology allows for the storage of four bits per cell, compared to three bits for TLC, and two and one bit for Multi-Level Cell (MLC) and Single-Level Cell (SLC), respectively. This means QLC NAND can further increase storage capacity compared to other NAND types.

SK hynix claimed that its HBM, manufactured with the company’s unique Mass Reflow-Molded Underfill (MR-MUF) technology, is 60% sturdier than products made using Thermal Compression-Non-Conductive Film (TC-NCF).

At Computex 2024, held from June 4-7 in Taipei, SK hynix demonstrated its latest advancements in AI memory solutions under the theme "Memory, The Power of AI." The company highlighted its innovative products, including AI server solutions, cutting-edge memory technologies for on-device AI PCs, and consumer-grade SSDs.

The Korean government has initiated a review of policy support, including tax benefits, for materials, parts, and equipment essential for High Bandwidth Memory (HBM) chip manufacturing. This move aims to bolster the country's semiconductor industry, a critical pillar of its economy.

Samsung Electronics has recently announced that hybrid bonding technology is essential for High Bandwidth Memory (HBM) starting from 16 stacks, marking a significant milestone in semiconductor storage technology. This move is expected to propel the development of high-performance computing and artificial intelligence sectors.