Overall, although the spot market has shown divergence in the short term due to adjustments in demand structure, the server DRAM market continues to operate strongly against the backdrop of persistent price hikes by original makers and tight supply. The original makers' price benchmark is expected to continue shifting upward in the second quarter.

Samsung Electronics' latest financial results show that in Q1 2026 its revenue reached 133.9 trillion South Korean won, up 43% quarter-on-quarter and 69% year-on-year. Operating profit stood at 57.2 trillion won, surging 184.6% quarter-on-quarter and 7.5 times year-on-year. Net profit hit 47.2 trillion won, rising 140.5% quarter-on-quarter and 4.8 times year-on-year. Its Q1 Memory business revenue came in at 74.8 trillion won, up 101% quarter-on-quarter and 292% year-on-year. Samsung Electronics stated that its HBM shipments in the first quarter more than tripled year over year. Starting from Q2 2026, the company plans to supply prototype products of its 7th-generation HBM (HBM4E) to key customers. It expects HBM4 shipments to account for over half of total HBM shipments beginning in the third quarter.

The current Memory market is in a phase of stark contrast. Driven still by the dominant logic of AI, contract prices for server NAND and DRAM from original manufacturers — despite the high base from a violent doubling surge last quarter — continue to maintain significant room for price increases in Q2. The PC market, in order to secure supply support, is absorbing even higher price hikes, with contract prices increasingly converging toward those of the server market. Meanwhile, the mobile phone market is experiencing some divergence in original manufacturers' supply and pricing strategies due to certain non-market factors, though mobile Memory prices generally remain on an upward trend.

NVIDIA has released Nemotron 3 Nano Omni, an open-source omni-modal model that continues the "Nano" positioning, emphasizing high cost-performance and inference efficiency. The model involves approximately 30 billion total parameters and supports ultra-long context windows of up to one million tokens. The model adopts a 30B-A3B Mixture-of-Experts (MoE) architecture and integrates Mamba layers with Transformer layers at the architectural level. According to official data, this hybrid design improves Memory and computational efficiency by up to 4 times. When benchmarked under a fixed user interaction latency threshold, the model achieves approximately 9.2× higher effective system capacity for video reasoning tasks compared to other open omni-modal models, and approximately 7.4× higher effective system capacity for multi-document reasoning tasks. Companies in AI and software sectors such as Foxconn and Palantir have already adopted the new model, while Dell and Oracle are currently evaluating it.

Longsys released its first-quarter report for 2026. In 2026Q1, the company achieved operating revenue of RMB 9.909 billion, representing a year-on-year increase of 132.79%. Net profit attributable to shareholders of the listed company reached RMB 3.862 billion, up 2,644.05% year-on-year. After deducting non-recurring gains and losses, the net profit attributable to shareholders of the listed company stood at RMB 3.943 billion, a year-on-year surge of 2,051.40%.

According to South Korean media reports, Samsung Electronics has produced a working die for a sub-10 nanometer DRAM process. Industry sources said that Samsung identified a functioning die during testing of wafers fabricated last month using its 10a process. The result reflects the first application of a 4F² cell architecture and a vertical channel transistor (VCT) structure. It is understood that Samsung aims to complete the development of 10a DRAM this year, conduct quality testing next year, and begin mass production in 2028. The company plans to use the 4F² and VCT structures across three generations — 10a, 10b and 10c — before transitioning to 3D DRAM at 10d.

SK Hynix expects that in the second quarter, DRAM bit shipments will increase 7%-9% quarter-on-quarter, and NAND bit shipments (including Solidigm) will increase 16%-17% quarter-on-quarter.

With sequential read speed of up to 10,300 MB/s and sequential write speed of up to 10,000 MB/s, along with random read and write performance reaching up to 1.4 million and 1.3 million IOPS respectively, the KIOXIA BG8 Series enables responsive system performance across a wide range of client workloads.

Nextorage has announced the launch of its G Series EEA solid-state drives, available in four capacity options, including 1TB, 2TB, 4TB, and 8TB. It features a PCIe Gen4 × 4 interface and utilizes 3D QLC NAND flash Memory while its overall architecture adopts a DRAM-less HMB+SLC Cache design. Although Nextorage provides in-warranty write endurance of no less than 400 TBW per TB for the G Series EEA SSDs, the warranty period is only one year.

JEDEC previewed a set of new features planned for incorporation into the next version of its JESD209‑6 LPDDR6 standard. It has been working to enhance the next version of the standard to extend LPDDR6 beyond mobile platforms to support selected data center and accelerated computing workloads. Planned features for the upcoming LPDDR6 update include as follows: narrower per-die interface (x6) enabling higher capacities; flexible metadata carve‑out intended to minimize impact to peak data throughput; 512 GB density on the horizon; LPDDR6 SOCAMM2 module standard in development. In addition, JEDEC is also nearing completion of a standard for LPDDR6 Processing‑in‑Memory (LPDDR6 PIM) technology.

On April 21, Kioxia announced the launch of its EG7 series solid state drives (SSDs) for PC OEM customers. As the company's first client solution based on BiCS8 QLC technology, the DRAM-less KIOXIA EG7 Series leverages mature Host Memory Buffer (HMB) technology, supports PCIe® 4.0 specification compliant and incorporates NVMe™ 2.0d support. It is available in three capacities, including 512GB, 1024GB, and 2048GB, with maximum sequential read and write speeds of 7,000 MB/s and 6,200 MB/s, respectively. The EG7 Series is currently sampling to select PC OEM customers, with PC shipments equipped with the SSD expected to begin from the second quarter of 2026 onwards.

Over the past month, trading prices of mainstream consumer-grade SSDs and UDIMMs in the channel retail segment have continued to decline. Lacking genuine buying interest, there are currently no signs of stabilization. The pressure of reverse price spreads (where spot prices fall below procurement costs) in the channel market is intensifying. Coupled with the persistent slow decline in low-end channel resources, channel vendors are offering small price concessions to actual order customers to facilitate transactions. This week, UDIMM and channel SSD prices generally continued to fall.

Recently, China's first domestically developed automotive-grade, advanced-process multi-domain fusion chip, the "Hongqi 1," has been successfully developed. The chip is a joint effort by China FAW and several local tech companies. It achieves hardware-level integration of five major functional domains — including intelligent driving, cockpit infotainment, and body control — marking a critical step forward for China in the field of high-end automotive central compute chips.

April 15 – Tesla CEO Elon Musk announced on social platform that the company's next-generation AI5 autonomous driving chip has successfully completed tape-out. Musk expressed gratitude to partners including TSMC and Samsung, and stated that the AI5 "will become one of the highest-volume AI chips in the world." He also revealed that multiple chips, including the AI6 and Dojo 3, are in parallel development.

DJI has unveiled the Osmo Pocket 4, an all-new 1-inch sensor pocket gimbal camera. While retaining the portable form factor of its predecessor, the device features upgraded imaging performance. It supports 4K/240fps high-frame-rate recording, comes with a built-in 107GB storage, and offers ultra-fast export speeds of up to 800MB/s without the need for an additional Memory card. The Osmo Pocket 4 Standard Combo and Ultimate Combo are priced at RMB¥2,999 and RMB¥3,799 respectively.