SK Hynix announced on Jan. 13 that it has decided to make a new investment in the advanced packaging fab P&T7 to stably respond to global artificial intelligence (AI) memory demand and optimize production at the Cheongju fab.”

NVIDIA will establish a research and development (R&D) hub in Korea. This follows up on the commitment made by NVIDIA CEO Jensen Huang, who visited Korea in October last year and announced plans to supply over 260,000 high-performance AI Semiconductors.

Netlist claims that Samsung Electronics’ core memory products, including High Bandwidth Memory (HBM) and DDR5, have infringed on its technology patents. The company has requested the ITC to issue exclusion orders and cease-and-desist orders to prevent the import of the allegedly infringing products into the United States.

South Korea's 2025 Semiconductor Exports Hit Record High of $173.4 Billion

U.S. Eases Equipment Import Restrictions for Samsung and SK Hynix's China Factories

South Korean Media: Samsung to Expand HBM Capacity by Nearly 50% Next Year, Focusing on HBM4

Sources: Samsung Pyeongtaek P4 Fab Construction Accelerated, HBM4 Mass Production Likely to Kick Off Earlier

KYEC: 2026 Capital Expenditure to Hit $1.28 Billion, a New All-Time High; 2025 Capex Revised Up Twice to $12.00 Billion on Strong AI/HPC Test Demand

Dapu Micro Secures GEM IPO Approval

Samsung and Samsung Advanced Institute of Technology on Tuesday unveiled its technology to make DRAM smaller than 10-nanometer (nm).

According to industry sources on Dec. 1, Samsung Electronics’ HBM production volume has recently expanded to 170,000 wafers per month based on wafer input, surpassing SK Hynix’s 160,000 wafers. Samsung Electronics had previously maintained around 150,000 wafers per month.

Samsung Electronics has conducted an organizational restructuring, dissolving the High Bandwidth Memory (HBM) development team that was established last year and reorganizing it under the DRAM development division.

Samsung Electronics has announced the completion of its regular 2026 executive personnel adjustments, which included the promotion of 161 executives to positions such as EVP, VP, Fellow, and Master. This represents a significant increase compared to last year's 137 promotions.

The PM9E1 is Samsung Electronics’ industry-leading PC SSD in terms of performance and capacity, with sequential read and write speeds of up to 14.5 gigabytes (GB) per second.

Samsung Electronics presented a target pin speed of over 13Gbps for HBM4E, which is under development for 2027. HBM4E has 2,048 pins for data transfer, which translates to 3.25TB/s when converted to bytes (1 byte equals 8 bits). Simultaneously, Samsung Electronics stated that the power efficiency of HBM4E would be more than twice that of the current HBM3E, which is 3.9 picojoules (pJ) per bit.