Production capacity at Fab2 will ramp up in stages over time, in line with market trends, with meaningful output expected to begin in the first half of 2026.
Samsung Electronics aims to expand HBM supply with the P5 groundbreaking.
According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.
Silicon Motion Technology Corporation announced the addition of Mr. Jeffrey Ju as Senior Vice President of Platform & Strategy to drive strategic platform development and ecosystem partnerships.
SK hynix Inc. plans to build a new Semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.
According to industry sources on July 19, Samsung Electronics achieved a 50-70% yield rate in performance tests of 10nm (nanometer) class 6th-generation DRAM wafers last month. This marks substantial progress compared to the less than 30% yield rate recorded for the same product last year.
Samsung Electronics posted KRW 79.14 trillion in consolidated revenue, an all-time quarterly high, on the back of strong sales of flagship Galaxy S25 smartphones and high-value-added products. Operating profit increased to KRW 6.7 trillion despite headwinds for the DS Division, which experienced a decrease in quarterly revenue.
SK Hynix’s Semiconductor plants in Icheon City, Gyeonggi Province, and Cheongju City, Chungbuk Province achieved an impressive export value of approximately 8.2783 trillion won (approximately $5.7 billion) in the first quarter according to the Korea Customs Service on April 15.
SK hynix Inc. has shipped 12-layer HBM4 samples to major customers, accelerating competition in the next-generation artificial intelligence (AI) Semiconductor market.
Samsung Electronics has announced a significant reduction in its foundry division's facility investment for this year, cutting the budget by more than half compared to the previous year. Samsung Foundry has set its facility investment budget at around 5 trillion won for 2025, a sharp decrease from the 10 trillion won range invested in 2024.
Micron’s HBM advanced packaging investment of approximately US $7 billion (SG$9.5 billion) .
In addition to advancements in custom chip design, significant changes are also occurring in the memory market.
Samsung Electronics has embarked on establishing a test line to improve the yield of its 7th generation (1d) DRAM, a memory two generations ahead, at the 10nm (nanometer, one billionth of a meter) level.
Samsung Electronics has successfully completed the development of its groundbreaking 400-layer NAND technology at its Semiconductor Research Institute.
Exports of mainstay Semiconductors stood at $12.5 billion, up 30.8 percent during the cited period. Pharmaceutical exports also climbed 19.6 percent year-on-year to a record $1.4 billion in November.