Reuters reports ByteDance is in talks to buy at least 50,000 AI Chips from Shanghai-based Iluvatar CoreX, primarily for inference workloads powering its Doubao chatbot. If the deal is completed, it would make Iluvatar CoreX ByteDance's third major domestic GPU supplier after Huawei and Cambricon. It is said that ByteDance is also considering a similar deal with Baidu. Deal details remain subject to change and none of the companies commented.
According to Korean media reports, Samsung Electronics is pushing ahead with the construction of an advanced semiconductor packaging (back-end process) plant in Gwangju, marking the company's first semiconductor production base in the Honam region (its current facilities are mainly concentrated in the Chungcheong region). This will be Samsung Electronics' first new packaging facility in 35 years since the establishment of its Onyang plant. The project is also expected to include front-end production lines for DRAM and NAND flash memory. The investment plan is reportedly scheduled for discussion on the 29th during a meeting chaired by President Lee Jae-myung, which will include heads of major corporate groups including Samsung.
Alibaba released its financial results for the fourth quarter of fiscal 2026 (January–March 2026): total revenue reached 243.38 billion yuan, representing a year-on-year increase of 3%. Revenue of China E-commerce Group stood at 122.22 billion yuan, up 6% year-on-year, while profits declined notably year-over-year, mainly dragged by hefty subsidies for food delivery services. International Digital Commerce Group posted revenue of 35.429 billion yuan, a 6% year-on-year rise, with losses narrowing sharply. Alibaba Cloud recorded revenue of 41.626 billion yuan, surging 38% year-on-year. Other businesses remained loss-making.
On April 20, Amazon announced a $5 billion investment in Anthropic, with the potential to invest up to an additional $20 billion in the future tied to certain commercial milestones. The two parties have deepened their partnership, with Amazon Web Services (AWS) granting Anthropic access to up to 5 gigawatts(GW) of current and next-generation Trainium chips to train and power AI models. In return, Anthropic will invest over $100 billion in AWS technologies and chips over the next decade, using AWS Trainium chips to run its large language models.
April 15 – Tesla CEO Elon Musk announced on social platform that the company's next-generation AI5 autonomous driving chip has successfully completed tape-out. Musk expressed gratitude to partners including TSMC and Samsung, and stated that the AI5 "will become one of the highest-volume AI Chips in the world." He also revealed that multiple chips, including the AI6 and Dojo 3, are in parallel development.
According to Taiwanese media reports, TSMC's CoPoS (Chip-on-Panel-on-Substrate) pilot production line began equipment delivery in February this year and is expected to be fully completed by June. The line is located at the facility of TSMC's subsidiary Visera, with small-volume trial production scheduled for the second half of 2026.
April 15, 2026 – ASML Holding N.V., the global leader in semiconductor equipment, today released its first-quarter 2026 financial results. Driven by sustained investment in artificial intelligence (AI) infrastructure, the company’s performance exceeded market expectations across the board, and it raised its full-year outlook. ASML reported first-quarter net sales of €8.8 billion (approximately RMB 70.7 billion), net income of €2.8 billion (approximately RMB 22.5 billion), and a gross margin of 53.0%. Due to seasonal factors, revenue declined sequentially from the fourth quarter of 2025, but rose 13.3% year-on-year.
According to media reports, Samsung recently announced that it plans to achieve mass production of the 1nm process by 2030, becoming the first manufacturer to publicly disclose a timeline for the 1nm production node, aiming to compete with TSMC for leadership in advanced process technology. Currently, TSMC's publicly announced most advanced process roadmap has entered the Angstrom era. Its next-generation logic process, A14 (1.4nm), is expected to enter production in 2028.