Samsung Targets 1nm Process Mass Production by 2030

According to media reports, Samsung recently announced that it plans to achieve mass production of the 1nm process by 2030, becoming the first manufacturer to publicly disclose a timeline for the 1nm production node, aiming to compete with TSMC for leadership in advanced process technology. Currently, TSMC's publicly announced most advanced process roadmap has entered the Angstrom era. Its next-generation logic process, A14 (1.4nm), is expected to enter production in 2028.

Industry sources have revealed that the transistor density of the 1nm process is twice that of the 2nm process, making the technical difficulty significantly higher and positioning it as a key milestone in chip scaling. To overcome physical limitations, the main architecture of Samsung's 1nm process will shift from the current gate-all-around (GAA) structure to a "fork sheet" structure. By incorporating an insulating layer between the nanosheets, this approach further increases transistor density, thereby improving power efficiency and performance.

At the same time, Samsung is also optimizing its existing advanced processes and actively pursuing orders from major clients. Industry sources pointed out that Samsung has developed a customized 2nm process called "SF2T," which will primarily supply Tesla's next-generation AI chip, AI6. Mass production is expected to begin in 2027 at Samsung's new plant in Texas.