At the High-Level Forum on Smart Electric Vehicle Development, Shan Jizhang, Founder and CEO of Black Sesame Technologies, fully unveiled the all-new lineup of the Huashan A2000 family to the industry for the first time. The family includes four chips, covering full-scenario computing power needs ranging from AI-enabled cockpits to L4-level Robotaxis. On the core technology front, the A2000 family features a proprietary near-Memory computing architecture, equipped with a 100-megabyte-level dedicated high-speed on-chip cache with 8 TB/s bandwidth, dramatically reducing processing latency. Shan Jizhang stated that the company's business grew by 73.4% in 2025, and is expected to surpass that growth rate in 2026, with chip shipments projected to far exceed 10 million units in 2026.

Maxio Technology announced that it plans to raise up to 2.062 billion yuan through a private placement, which will be used for the R&D project of its next-generation data Memory controller chip series products for data centers and intelligent terminals. It includes enterprise-grade PCIe Gen6 SSD controller chips, enterprise-grade PCIe Gen7 SSD controller chips, consumer-grade PCIe Gen6 SSD controller chips, UFS 5.0 embedded storage controller chips, as well as to supplement working capital.

According to Aju Daily, Samsung Electronics and SK hynix have decided to sign 3-5 year long-term supply contracts with major global technology companies, moving away from one-year short-term agreements. Samsung Electronics previously stated that it is pushing to convert its supply contracts from annual or quarterly terms to multi-year agreements lasting three to five years, and is expected to stably supply three-year Memory products to key customers such as Microsoft and Google. It is said that SK hynix is in discussions with Google regarding a five-year long-term supply contract for general-purpose DRAM in order to maximize supply stability. This move aims to establish a stable, high-margin business model through strategic cooperation with customers in the early stages of AI Memory development.

Although since the end of last month, some traders have been offloading existing inventory to accelerate capital turnover, leading to significant corrections in channel Memory modules—especially DDR4 products—after the three-day Qingming holiday, the price volatility caused by previous trade selling pressure has gradually subsided. However, market sentiment remains very weak. Clients across various application segments—including channel, embedded, and industrial—still hold certain levels of inventory, and short-term wait-and-see sentiment prevails. As a result, spot Memory prices have generally stayed flat this week.

Conventional silicon-based chips suffer from sharp performance degradation or complete failure when temperatures exceed 200°C. This "thermal limit" has long constrained the development of electronic systems for high-temperature scenarios such as aerospace, energy, and automotive applications. Recently, a research team from the University of Southern California has successfully developed a new type of Memory device capable of stable operation at an extreme temperature of 700°C, potentially breaking this bottleneck. The findings have been published in the top international journal Science.

Techwinsemi Releases 2026Q1 Performance Forecast. The company expects revenue for the first quarter of 2026 to reach RMB 7.3–7.8 billion, representing a year-on-year increase of 483.05%–522.98%. Net profit attributable to shareholders of the listed company is projected to be RMB 3.15–3.65 billion, compared with a loss of RMB 69.09 million in the same period last year. After deducting non-recurring gains and losses, net profit is expected to be RMB 3.14–3.64 billion, versus a loss of RMB 74.96 million in the prior-year period. During the reporting period, against the backdrop of tight supply, the industry's prosperity continued to rise, and Memory prices kept increasing. Leveraging its ample strategic reserve of raw materials accumulated earlier, the company saw sustained improvement in profitability and a significant increase in profit levels.

On the evening of March 30, GigaDevice released its 2025 annual report. During the reporting period, the company achieved operating revenue of RMB 9.20 billion, representing a year-on-year increase of 25.12%; net profit attributable to shareholders of the listed company was RMB 1.65 billion, up 49.47% year-on-year. The company's steady revenue growth was primarily driven by the synergistic effects of improved industry structure, steady execution of the company's strategy, and rapid technological iteration. By product segment, Memory chip revenue increased 26.41% yoy, with gross margin rising 2.57 percentage points to 42.84%; microcontroller (MCU) revenue grew 12.98% yoy, with gross margin decreasing 0.92 percentage points; sensor revenue declined 13.15% yoy, while gross margin increased 3.11 percentage points; analog product revenue surged 2,051.82% yoy, with gross margin increasing 26.43 percentage points to 36.96%.

According to Lenovo's PSREF (Product Specifications Reference) webpage, the company has launched the IdeaPad Slim 5x (11) thin-and-light laptop powered by Qualcomm's 6-core Snapdragon X2P-42-100 processor, available in 13.3-inch and 15-inch models. The Snapdragon X2P-42-100 is currently the lowest-tier model in Qualcomm's Snapdragon X2 series. It features only 6 CPU cores, equipped with a significantly underclocked X2-45 GPU running at 0.91GHz, while still delivering 80 TOPS of NPU compute power. Both models of the IdeaPad Slim 5x (11) come with soldered LPDDR5X-9523 Memory and offer one PCIe Gen4 ×4 M.2 2242 slot.

On March 27, CFMS | MemoryS 2026 will be held at the JW Marriott Hotel Shenzhen Qianhai under the theme "Transcending Cycles · Unleashing Value" .This year's summit brings together global core players from Memory, CPU/GPU, AI large models, automotive, and other sectors, offering cutting-edge insights and exploring the future development and trends of the industry in the current landscape.

Recently, the Shenzhen Municipal Industry and Information Technology Bureau officially issued the Action Plan for Promoting High-Quality Development of the Artificial Intelligence Server Industry Chain in Shenzhen (2026–2028). The plan outlines eight key areas across the AI server industry chain, emphasizing Shenzhen’s industrial strengths and adhering to innovation-driven, software-hardware coordinated development. It aims to foster integrated and innovative growth across the entire industry chain, building the most complete supporting facilities, the most efficient resource allocation, and the most robust innovation ecosystem for the AI server industry chain, ultimately establishing Shenzhen as a hub for large-scale AI computing cluster R&D and manufacturing.

On March 24, Intel's unreleased Wildcat Lake series processors — Core 5 320 and Core 3 310 — appeared in the BAPCo CrossMark and Geekbench databases. This series features a 2P+4LP-E core configuration (2 performance cores + 4 low-power cores) and supports single-channel LPDDR5x-7467 / DDR5-6400 Memory. No test records for Core 7 models have been found yet. Industry observers expect that after the official release, this series of processors will be widely adopted in entry-level Windows thin-and-light laptops, Chromebooks, and similar products.

According to foreign media reports, SK Hynix plans to acquire extreme ultraviolet (EUV) lithography equipment valued at approximately 12 trillion won (around 55.4 billion yuan) for the mass production of next-generation DRAM and high-bandwidth Memory (HBM). The investment accounts for about 9.97% of SK Hynix’s total assets, with Dutch semiconductor equipment giant ASML as the supplier. The procurement period is expected to run through December 2027.

On March 23, the ZimaCube 2 NAS was officially launched in overseas markets. The device is powered by Intel Alder Lake processors (entry-level i3-1215U, high-end i5-1235U), features dual 2.5G Ethernet ports with an optional 10GbE port. It offers six SATA drive bays and four NVMe M.2 slots, supporting up to 164TB of storage expansion, with Memory upgradeable to 64GB. Ports include dual Thunderbolt 4, multiple USB-A and USB-C ports, a 3.5mm audio jack, and a PCIe slot. The starting price is $799.

STMicroelectronics (ST) today announced that the first batch of 40nm STM32 microcontrollers (MCUs), manufactured by HuaHong Grace, has been officially delivered to Chinese customers. This marks ST as the first international semiconductor company to complete the full-process production—from wafer fabrication to packaging and testing—of its mainstream MCU products within China.

At the Huawei Spring All-Scenario New Product Launch on March 23, the Mate 80 Pro Max Wind Edition was officially released. The device debuts HyperSpace Memory technology, which supports powerful background app retention and redefines the Memory compression system, significantly raising the upper limit of compressible Memory.