Kioxia is working with Nvidia to build extremely fast AI SSDs to augment high-bandwidth Memory (HBM) by being directly connected to GPUs, with 2027 availability.

The abandonment of SOCAMM1, if accurate, resets what was expected to be a fast-tracked rollout of modular LPDDR-based Memory in Nvidia’s data center stack. SOCAMM has been positioned as a new class of high-bandwidth, low-power Memory for AI servers, delivering similar benefits to HBM but at a lower cost.

Samsung Electronics aims to expand HBM supply with the P5 groundbreaking.

Sandisk announces price will increase in excess of 10% on all products for channel and consumer customers.

The global DRAM market size in the second quarter of 2025 increased by 20% quarter-on-quarter to $32.101 billion, marking a new historical quarterly high.

SK Hynix expects this market for custom HBM to grow to tens of billions of dollars by 2030, Choi said.

Sandisk Corporation announced it has signed a landmark Memorandum of Understanding (MOU) with SK hynix to work together to establish the specification for High Bandwidth Flash – a new technology designed to deliver breakthrough Memory capacity and performance for the next generation of AI inferences. Through this collaboration, the companies expect to standardize the specification, define technology requirements and explore the creation of a technology ecosystem for High Bandwidth Flash.

The company's Board of Directors has approved an investment of NT$4–5 billion (approximately $124–155 million USD) to add Flash production capacity at its Taichung plant. The annual capacity for NOR Flash and SLC NAND is expected to rise by more than 20%. Among these, SLC NAND faces tight market supply due to capacity crowding-out by eMMC production, indicating promising future growth potential.

Both revenues and operating profits stood at all-time highs, beating the previous best results in the fourth quarter of last year.

Building on its newly launched aerospace portfolio, Micron plans to introduce additional space-qualified Memory and storage solutions in the coming year and beyond to address the evolving demands of next-generation space missions.

With a blend of speed and low power use, Kioxia’s UFS Ver. 4.1 devices are built to enhance user experiences—enabling faster downloads and smoother app performance.

According to Korean media reports, Samsung Electronics has recently completed quality testing of its 12-layer HBM3E products with Broadcom and is now negotiating mass production supply. The current discussions involve an estimated supply volume of approximately 1 billion gigabits (Gb), with mass production expected to begin as early as the second half of this year and extend into next year.

Samsung Electronics achieved a significant technological milestone by securing production readiness approval for its sixth-generation DRAM technology.

SK hynix Inc. plans to build a new semiconductor back-end process facility in central South Korea to enhance its chip-packaging capabilities, industry sources said Tuesday.

KIOXIA America, Inc. announced the development and prototype demonstration of its new KIOXIA CD9P Series PCIe 5.0 NVMe SSDs.