According to South Korean media reports, Samsung Electronics plans to launch a dedicated solution for AI inference this August, integrating Processing-in-Memory (PIM) technology onto LPDDR5X Memory.

According to a report by South Korean media ZDNET citing industry sources, SK hynix has recently begun recruiting 3D stacked DRAM logic design engineers through its U.S. subsidiary based in San Jose. The design of 3D stacked DRAM logic chips is a cutting-edge stacking technology that vertically places DRAM directly on top of logic semiconductors (system semiconductors). It is expected that in the post-generative AI era, the physical AI era, this technology will become a core semiconductor solution for edge AI devices that adopt on-device deployment. SK hynix is accelerating the development of 3D stacked DRAM and has already established partnerships with specific customers to advance the commercial application of the technology.

According to media reports, Samsung Electronics held a special seminar at the "AMD Advancing AI 2026" event and announced the results of its collaboration with AMD. James Ahn, a senior engineer at Samsung, said that Samsung's HBM4 will be used in AMD's latest AI accelerators, the Instinct MI455X, and the Helios platform. Under the architecture, the Instinct GPU series uses HBM4 and HBM3E, the server CPU EPYC series uses RDIMM DRAM modules, and the Helios platform employs both RDIMM and HBM4. It is reported that the partnership between AMD and Samsung will be further strengthened in the next-generation product, HBM4E (7th-generation HBM).

According to South Korean media reports, Samsung Electronics has signed an MOU with Asan City in South Chungcheong Province, finalizing plans for the expansion of its Onyang plant. The new plant is scheduled to break ground in October of this year, with the goal of achieving mass production of HBM by May 2029. The project is reportedly the first of South Korea's three government-designated "Mega Projects" to materialize, with a total investment of 46 trillion won, of which 6 trillion won will be allocated to building the HBM production lines.

SK Hynix has increased its investment in the Cheongju P&T7 project to 7.0931 trillion won (approximately $4.8 billion) to proactively address the growing demand for AI Memory.

According to South Korean media reports, Samsung Electronics is expanding its alliance with Nvidia into NAND flash supply. Industry sources indicated that Samsung Electronics has built V-NAND production capacity of more than 100,000 wafers per month, and is mass-producing its 10th-generation V10 product for supply to Nvidia. It is said that Samsung has allocated about 60% of its V-NAND production capacity to V9, which intended to meet the NAND demand for NVIDIA CMX in the second half of the year. In addition, trial production of the 500-layer-class V11 has begun earlier this year, and Samsung plans to double related volumes in the second half.

From the buyer side, a meaningful price gap still exists between 8GB/16GB/32GB and 64GB eMMC. Ample short-term supply has weakened customers’ urgency for capacity migration. Additionally, capacity upgrades entail certain cost premiums. These two factors jointly curb customers’ motivation to shift to 64GB eMMC. As a result, prices of 64GB eMMC dipped slightly this week, weighed down by falling raw material trading prices, lingering weak demand, and aggressive price competition among peers.

According to media reports, Adata Chairman Chen Li-Pai stated that it is premature to talk about an AI bubble at this stage. In the future, AI applications will expand comprehensively across different business models including B2B, B2G, B2C, and B2B2C, with computing power demand continuing to grow. He believes that two of the most scarce global resources over the next decade will be Memory and electricity (particularly green power). With supply expansion constrained, Chen expects Memory prices to continue rising in the second half of the year. As long as product quotations move higher and there is sufficient inventory available for sale, there is no reason for related companies' profits to be revised downward, and profit opportunities in the second half are expected to continue increasing.

According to Yonhap News Agency, SK Group Chairman, Tae-won Chey, stated at a media roundtable held during the Jeju Forum that global semiconductor product demand will grow by at least 50% to 60% next year, with demand in the AI sector expected to increase by 60% to 100% compared to this year. However, with virtually zero new supply coming online next year, the supply-demand gap is likely to widen further. Chey believes that current chip prices are already at abnormally high levels and should have seen a correction. He also emphasized that semiconductor companies should not maintain high prices by restricting supply, and that expanding supply to grow the market is a more strategically valuable long-term approach.

The jury determined that Kioxia's NAND Flash products infringed on a Viasat patent that effectively reduces device power consumption while significantly improving the reliability and lifespan of Memory devices.

According to Korean media citing industry sources, Samsung Electronics' Memory Business has recently set up a dedicated backend process organization within its etching technology team.

Micron has announced that it has signed Strategic Customer Agreements (SCA) with seven key technology suppliers that underpin the automotive ecosystem, including Qualcomm, Visteon, HARMAN, JOYNEXT, DENSO, Astemo, and Hyundai Mobis.

According to South Korean media reports, Samsung Electronics has mostly confirmed the semiconductor equipment companies that will build the P5 Phase 1 line, and the process of selecting suppliers for additional lines after Phase 2 is progressing simultaneously. Equipment orders for P5 will begin in earnest. Orders for semiconductor equipment on the scale of tens of trillion won are imminent. Originally, the target for full operation of the P5 line was known to be 2028, but the first line (Phase 1) is expected to be operational as early as next year.

According to media reports, General Manager of PSMC, Chu Hsien-Kuo, stated at the company's earnings conference that the company has raised its Memory foundry prices by 45% effective this month. The related production capacity is expected to come online in November. It is said that that its self-developed OneX DRAM process entered small-volume trial production in June, and is currently advancing yield optimization and customer qualification efforts. Meanwhile, the OneP process, jointly developed with Micron, is scheduled to complete equipment installation in the first quarter of next year, with mass production targeted for mid-2028.

In the first quarter of this year, Maxio Technology recorded an operating revenue of RMB 355 million and a net profit attributable to parent company shareholders of RMB 8.86 million. Based on this, the estimated Q2 operating revenue is RMB 495 million, a 39% increase QoQ; the estimated net profit attributable to parent company shareholders is RMB 508 million, a 57.37-fold increase QoQ.