Samsung Electronics: Developing zHBM, Which Cores on Stacking HBM into a 3D Structure

According to Samsung Electronics’ Chief Technology Officer Song Jai-hyuk, customers have expressed satisfaction with Samsung’s HBM4 products, and he added that the company will continue its efforts to maintain a leading position in the next-generation HBM4E and HBM5 product segments.

Samsung is preparing to develop enhanced memory chips to meet the demand for high-performance products in the artificial intelligence field. As AI evolves from agent AI to physical AI, Samsung is currently researching technologies that can reduce memory bandwidth constraints and has obtained test results indicating that power consumption can be lowered while reducing the number of I/Os (input/output).

He stated that Samsung is currently developing zHBM, which centers on stacking HBMs in a 3-D structure, and is expected to bring another major innovation in terms of bandwidth or energy efficiency required in the era of physical AI.