SK hynix Reportedly Begins Developing 3D Stacked DRAM Technology for On-Device AI

According to a report by South Korean media ZDNET citing industry sources, SK hynix has recently begun recruiting 3D stacked DRAM logic design engineers through its U.S. subsidiary based in San Jose. The design of 3D stacked DRAM logic chips is a cutting-edge stacking technology that vertically places DRAM directly on top of logic semiconductors (system semiconductors). It is expected that in the post-generative AI era, the physical AI era, this technology will become a core semiconductor solution for edge AI devices that adopt on-device deployment. SK hynix is accelerating the development of 3D stacked DRAM and has already established partnerships with specific customers to advance the commercial application of the technology.