Intel Lip-Bu Tan Warns AI-fueled Memory Crunch to Deepen Next Year

According to media reports, Intel CEO, Lip-Bu Tan, expects the memory supply shortage to become more severe next year due to growing AI demand. He noted that some memory prices have already climbed five to seven times and many corporations are slow to expand their businesses because they can't secure enough memory. He explained that as demand for high bandwidth memory (HBM) for AI surges, pressure is growing on the supply of commodity DRAM as well. In addition, Lip-Bu Tan stressed the importance of advanced packaging technology, emphasizing that CPU, AI accelerators, HBM, and I/O chips should be connected within a single package to shorten data travel distance and improve processing speed and power efficiency. Intel is targeting the AI Semiconductor market with its own advanced packaging technology, EMIB.