CXMT Reportedly Accelerates DDR6 Layout, Aiming for World's First Mass Production of LPDDR6 in 2H2026

According to media reports, CXMT is moving early to lay out its DDR6 supply chain, having brought in new packaging substrate and lead frame supplier Haesung DS. It is also considering switching to panel‑level processes that support multi‑layer designs, replacing the Reel-to-Reel production method used for DDR4 and DDR5, in order to meet the more demanding multi‑layer requirements of DDR6. It is said that CXMT's LPDDR6 chips have already entered the sampling phase and are expected to achieve the world's first mass production in the second half of 2026, with the speed of 12.8 Gbps, directly competing with flagship products from Samsung and SK hynix.