TuringEvo Partners with National Integrated Circuit Innovation Center to Deepen Full-Chain Collaboration in AI Chips

Recently, AI chip company TuringEvo signed a strategic cooperation agreement with the National Integrated Circuit Innovation Center. The two parties will collaborate across the entire value chain in the fields of AI computing chips and key core chips, focusing on chip design, process adaptation, supply chain collaboration, and industrial implementation.

According to the agreement, TuringEvo will leverage the National Integrated Circuit Innovation Center's expertise in advanced processes and wafer testing to accelerate the research and development iteration of its self-developed AI chips. Meanwhile, the National Integrated Circuit Innovation Center will benefit from TuringEvo's market demand insights and application scenario expertise, helping to align research outcomes with industry needs. The two parties will also explore the establishment of joint laboratories to collaborate on chip architecture and algorithm optimization for applications such as large models, smart vehicles, and robotics.

TuringEvo is a hard-tech company specializing in AI computing chips, with its business covering multiple scenarios, including cloud, edge, and endpoint. The National Integrated Circuit Innovation Center, initiated by Fudan University, SMIC, and Huahong Group, is an important platform for common technology research and development in China’s integrated circuit industry. This collaboration aims to bridge the critical gap between technology research and market applications, accelerating the scaling and industrialization of domestic AI chips. In the future, both parties will further deepen their cooperation, driving continuous breakthroughs in key core technologies and speeding up the industrialization of domestic AI chips.