TSMC Plans to Launch Advanced Packaging Plant in Arizona, US, in 2029

According to Taiwan media reports, TSMC plans to launch its advanced packaging plant in Arizona, US, in 2029 to better serve the needs of American CSP customers, seize high-end packaging orders for AI and HPC, and strengthen its local supply chain presence. In addition, TSMC unveiled upgraded roadmaps for CoWoS and 3D stacking at its 2026 North America Technology Symposium, elevating the role of packaging from "supporting" to "system core."