Taiwan's premier semiconductor foundry, TSMC, announced that it is on track to begin production of chips on its 7 nanometer silicon fab process by the first half of 2018. The company also announced that production on an even newer 5 nanometer process should commence two years later, in 2020. The company has currently cleared all decks for mass-production of chips on its 16 nm FFC (FinFET compact) node, with the company hoping to grab over 70% of the worldwide 14/16 nm production market-share by the end of 2016.
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