Winbond: Kaohsiung Module A Monthly Capacity to Expand to 24,000 Wafers, Module B Expansion Plan Initiated

Winbond recently held an investor conference, during which President Chen Pei-Ming stated that the existing Module A in Kaohsiung will see its monthly production capacity expanded from the current 15,000 wafers to 24,000 wafers, with wafer‑out production expected to commence at the end of this year.However, after the Module A expansion is completed, the factory space will be almost entirely utilized. In response to strong customer demand for capacity beyond 2029, the company has initiated the construction of Module B, which is scheduled to begin in 2027, with equipment installation and mass production targeted for 2029. The new module will support 16nm, 14nm, and 12nm process technologies, with actual output and revenue contribution mainly materializing in 2030. Future products will cover standard DRAM, CUBE, Wafer-on-Wafer, customized ASIC memory chips, and silicon capacitors.