According to a report by Korean media outlet Herald Corp, SK Hynix recently reaffirmed that mass production of its 12-layer HBM4 is proceeding as planned, while its 16-layer product has entered the qualification phase. In addition, SK Hynix has announced a plan to adopt hybrid bonding technology alongside its existing MR-MUF method, in preparation for scaling future HBM products to 20 layers or more.
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