Samsung Reportedly to Use TSMC's 3nm Process to Produce HBM for Nvidia

According to industry sources cited by Korean media, Nvidia is collaborating with Samsung Electronics and TSMC to design the base die, a core component of its proprietary HBM chip NVHBM. Industry insiders estimate that TSMC's 3nm process yield exceeds 90%, while Samsung Foundry's 2nm SF2 process yield is around 60%. For Nvidia, concentrating base die production at TSMC is a more stable choice. However, the report notes that it does not mean TSMC has locked in base die production for Nvidia's HBM. Although Samsung Electronics used TSMC's base die at Nvidia's request, it is also preparing to produce the component at its own fabs to meet growing demand. An industry insider said that TSMC's 3nm production lines also manufacture high-performance computing and smartphone chips, and allocated capacity may reach its limit. Therefore, Samsung Foundry is validating the production of Nvidia's HBM base die on its 2nm process, which is comparable to TSMC's 3nm process.