Kioxia Joins Applied Materials' EPIC Center to Co-Develop Next-Generation Advanced Memory Technology

Applied Materials announced that Kioxia has joined the "Applied Materials EPIC (Equipment and Process Innovation and Commercialization) Center" as an innovation partner, in order to advance the development of next-generation memory technology.

Under this collaboration, the two parties will jointly research advanced memory cell and structure formation, multi-chip stacking architectures, and new materials engineering approaches at the EPIC Center, with plans to thereby improve the memory density and performance required in the AI era.

Through this EPIC Center partnership, the two companies will jointly advance R&D initiatives focused on the most critical challenges in next-generation memory innovation. The goal is to develop higher-performance, higher-density memory architectures for AI applications, along with research into advanced memory cell and structure formation technologies.

In addition, the two parties will achieve chip integration through multi-chip stacking technologies for next-generation memory, improving memory density and performance within constrained form factors. In the field of advanced packaging for stacked memory, they will collaborate to improve the integration level and interconnect performance of complex multi-die memory solutions. At the same time, both sides are also exploring materials engineering innovations to realize next-generation memory structures while ensuring large-scale manufacturability.