Synopsys and TSMC Deepen Partnership to Accelerate Advanced AI Chip Design

Synopsys has announced a deepened collaboration with TSMC, advancing R&D around the A14 advanced process node, AI agent-assisted design, CoWoS multi-chip packaging, and co-packaged optics (CPO). The two companies will further expand their 2nm IP portfolio, completing tape-outs for key IPs including PCIe 7.0 and HBM4, while leveraging AI agents to automate analog, digital, and multi-chip design flows. Synopsys stated that the partnership will also advance CPO design verification for TSMC's COUPE technology, as well as multi-chip design related to 3DFabric.