Guangli Technology: Core Dicing Equipment Receives Mass Recognition from Leading Domestic Packaging and Testing Companies

Guangli Technology recently stated in response to inquiries from researchers that its independently developed domestic semiconductor mechanical dicing equipment has reached a level comparable to mainstream international models in terms of dicing quality and efficiency. This equipment has received high recognition from numerous customers, including leading domestic packaging and testing manufacturers, and has achieved mass repurchases. As a core piece of equipment in the semiconductor back-end packaging process, the dicing precision and yield of the dicing machine directly impact the performance and manufacturing cost of the final product.