TSMC: Expand Production at "Double-Speed" , First-Year Output of 2nm Chips to Increase by Approximately 45%

According to media reports, Y.C. Hou, Senior Vice President of TSMC, recently stated that in response to the surging demand for AI and high-performance computing (HPC), TSMC is accelerating its capacity expansion plans at "double speed". Five 2nm wafer fabs will simultaneously enter the capacity ramp-up phase in this year, setting a record for the company's most aggressive expansion in history. As a result, the first-year output of 2nm chips is expected to increase by approximately 45% compared to the same period for 3nm.