ASE Technology Holding Co., Ltd.'s Renwu Semiconductor Packaging and Testing Park breaks ground

On April 10th, ASE Technology Holding Co., Ltd. officially broke ground on its semiconductor packaging and testing park in Renwu, Kaohsiung. The project represents a total investment of over NT$108.3 billion (approximately RMB 23.3 billion), focusing on high-end semiconductor testing services, primarily covering advanced packaging and testing areas such as AI chips, HBM high-bandwidth memory, 3D stacking, and Chiplet heterogeneous integration. The park is planned to begin mass production in two phases in 2027. Upon completion, it will become a crucial testing base for ASE's AI and high-end computing chips, simultaneously driving the clustering and development of the upstream and downstream industry chains.