Intel and UMC Reportedly Partner to Develop 3nm and 12nm Chips

According to foreign media reports, Intel is cooperating with UMC to make chips on the 12-nanometer and 3-nanometer manufacturing process technologies. The production is expected to occur in Intel's Arizona plants. It is said that the two companies' collaboration on the 12nm process node will lead to products used in the internet of things (IoT) industry, the WiFi sector and others. Additionally, the collaboration is moving fast, and the first design kits should be delivered to customers this year in order to facilitate tape-outs at the start of next year and production at the close of 2027. Beyond 12nm, industry channels indicate that UMC is also collaborating withIntel on 3nm. Mirroring the structural setup of the 12nm project, UMC will notneed to deploy massive capex. The goal of this collaboration is to develop aprocess node with performance close to TSMC's 3nm, enabling Intel to offer 3nm foundry services to external clients.