MediaTek Dimensity SoC May Be Outsourced to Intel for Production

According to foreign media reports, Intel's foundry business has successfully secured a heavyweight client, MediaTek, and is expected to mass-produce Dimensity mobile chips using its most advanced 14A process. Apple had preliminarily confirmed Intel's 18A-P process for its entry-level M-series chips before, with shipments expected to begin as early as 2027.

From a technical perspective, applying Intel's 14A process to mobile chips such as MediaTek Dimensity series is not easy. Intel is fully committed to backside power delivery technology at both the 18A and 14A nodes. Although this decision can significantly enhance performance, it will lead to more severe self-heating effect.

With the extremely limited internal space of smartphones, self-heating poses a serious challenge for mobile SoCs. Additional cooling measures may be required to ensure stable operation. If Intel and MediaTek can successfully overcome this technical bottleneck, the possibility of a deeper collaboration between them cannot be ruled out.