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CFMS | MemoryS
2025-2026 Global Memory Market Trend White Paper
Memory Spot Market Industrial SSDs Steady with Moderate Gains; UDIMM,SODIMMs,and Channel SSDs Continue to See Downward Revisions
Samsung: Memory Revenue Contribution Exceeds 50% for First Time, HBM4 Expected to Account for Over Half of Total HBM Sales from Q3
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Phison: Enterprise SSD Brand Expected to Account for 40% of Total Revenue by 2026
2024-06-06 09:19 (UTC+0)
Enterprise News
Micron Technology Unveils Next-Gen GDDR7 Graphics Memory with Industry's Highest Bit Density
2024-06-05 08:52 (UTC+0)
Enterprise News
SK hynix’s Ryu Byung-hoon Urges Prudence in HBM Investments
2024-06-05 08:31 (UTC+0)
Industry News
Nvidia unveils Rubin, successor to Blackwell that will launch in 2026
2024-06-04 09:46 (UTC+0)
Industry News
ASML and imec open joint High NA EUV Lithography Lab
2024-06-04 07:17 (UTC+0)
Industry News
Hanwha ends Hanmi’s TC bonder dominance with SK Hynix deal
2024-06-03 06:52 (UTC+0)
Industry News
China surpasses US to become top export market for Korea
2024-06-03 06:48 (UTC+0)
Industry News
PSK supplies reflow equipment to Micron for HBM
2024-05-31 08:02 (UTC+0)
Industry News
Micron First to Achieve Qualification Sample Milestone to Accelerate Ecosystem Adoption of CXL 2.0 Memory
2024-05-30 06:52 (UTC+0)
Enterprise News
Korean：Accelerating Domestic Production of HBM Materials
2024-05-29 07:29 (UTC+0)
Industry News
Samsung, Intel Lead Next-generation Equipment Acquisition; TSMC Joins Chase
2024-05-28 07:02 (UTC+0)
Industry News
SK hynix Approaches 80% Yield with HBM3E
2024-05-23 06:34 (UTC+0)
Industry News
Samsung Electronics Names Young Hyun Jun as New Head of Device Solutions Division
2024-05-21 08:50 (UTC+0)
Enterprise News
Samsung, SK hynix Significantly Increase R&D, Facility Investments
2024-05-20 09:58 (UTC+0)
Industry News
TSMC Enters Battle for Leadership in HBM4 Tech
2024-05-20 09:55 (UTC+0)
Industry News
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18 hours ago
Vera Rubin NVL4-based Systems to Launch in 2026Q4
18 hours ago
Qualcomm Reportedly Nears Deal for AI Chip Startup Modular
18 hours ago
Samsung Unveils Industry's Fastest UFS 5.0, Mass Production Starts from Q4
18 hours ago
SK hynix Adjusts HBM4 Production Pace, Reallocates Resources to General DRAM
1 day ago
Samsung Electronics' HBM4 sales surpass $1 billion just four months after mass production
1 day ago
Micron and Anthropic Announce Strategic Agreement to Scale Next-Generation AI Infrastructure
1 day ago
Phison’s CEO: Flash Shortage Will Become an Irreversible Trend; Orders Booked Through Q2 2027
1 day ago
Samsung Convenes Global Strategy Meeting: Focuses on HBM Supply Strategy and Long-Term Agreements
1 day ago
MediaTek Said to Win Exclusive Deal for Upgraded Google TPU v9 Featuring HBM4E Memory
1 day ago
Samsung Electronics P5 Fab 2 Construction Reportedly Accelerated by 6 Months, Groundbreaking Scheduled for July
Hot News
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Micron and Anthropic Announce Strategic Agreement to Scale Next-Generation AI Infrastructure
SK hynix shifts to commodity DRAM as margins top HBM, opening Samsung HBM chance
Samsung Convenes Global Strategy Meeting: Focuses on HBM Supply Strategy and Long-Term Agreements
Phison’s K.S. Pua: NAND Flash Will Become an Irreversible Trend; Orders Booked Through Q2 2027
Notice of 2026 Dragon Boat Festival Holiday
Apacer Launches GraTherX Thermal Solution, Reducing DDR5 Temperatures by Up to 23.4°C
Reports: SK Hynix May Supply HBM4E Samples as Early as This Month
