BIWIN Plans 4.5 Billion Yuan Investment for Phase III of Wafer-Level Advanced Packaging and Testing Project

BIWIN announced that the company and its controlled subsidiary, Guangdong Xincheng Hanqi, intend to sign a cooperation agreement with the Administrative Committee of Dongguan Songshan Lake High-Tech Industrial Development Zone to invest in and construct Phase III of the wafer-level advanced packaging and testing manufacturing project. The total investment will be approximately 4.5 billion yuan, including 4 billion yuan in fixed asset investment. The project does not involve additional land acquisition, with all construction to be completed within the existing industrial land of the original project.