Hanmi Semiconductor Shows Next-Gen HBM4 Equipment at Computex 2026

According to Korean media reports, Hanmi Semiconductor unveiled its "TC Bonder 4" for HBM4 production and "Wide-Type TC Bonder" for next-generation HBM manufacturing at Computex 2026, which began mass production this year,. The wide-type TC bonder supports the production of HBM using larger DRAM dies. Hanmi Semiconductor stated that as HBM chip area increases, the number of TSVs (Through-Silicon Vias) and I/O interfaces can be stably increased, memory capacity and bandwidth can also be improved in comparison to previous technologies.