Samsung Reportedly Plans New Advanced Chip Packaging Plant in Gwangju

According to Korean media reports, Samsung Electronics is pushing ahead with the construction of an advanced semiconductor packaging (back-end process) plant in Gwangju, marking the company's first semiconductor production base in the Honam region (its current facilities are mainly concentrated in the Chungcheong region). This will be Samsung Electronics' first new packaging facility in 35 years since the establishment of its Onyang plant. The project is also expected to include front-end production lines for DRAM and NAND flash memory. The investment plan is reportedly scheduled for discussion on the 29th during a meeting chaired by President Lee Jae-myung, which will include heads of major corporate groups including Samsung.