PSMC to Hike Memory Foundry Quotes by 45% Starting July, New Capacity to Ramp in November

According to media reports, Chu Hsien-Kuo, General Manager of PSMC, announced during the firm's second-quarter earnings briefing that the company will raise memory wafer foundry prices by 45% effective July, with logic foundry fees set to climb 10%–15% concurrently.

Supply-Demand Imbalance to Last Until 2027, Underpinning Foundry Price Hikes

General Manager Chu Hsien-Kuo formally unveiled the new pricing schedule at its Q2 earnings conference. The firm will roll out across-the-board price increases for memory foundry services from July with a 45% uplift and a 10%–15% markup for logic manufacturing. The adjustment stems primarily from the enduring tight supply-demand landscape across the DRAM market. Chu projected that the industry's memory supply shortage will extend all the way to 2027.

The company's downstream customers have abundant orders while logic foundry order volume scheduled for Q3 2026 already hits 140% of its existing capacity. The widespread industry undersupply creates solid market fundamentals to support the round of price hikes.

New production capacity applicable to the revised pricing is slated to come online this November. Combined capacity ramp-up and higher unit quotes will jointly boost corporate top-line revenue and gross profit margins, while lifting the memory segment's weighting in PSMC's total revenue mix. Memory business already represented over 50% of the company's total revenue in Q2 2026, and its earnings contribution is poised to expand further as price adjustments and capacity expansion materialize in parallel.

Self-Developed OneX DRAM Enters Trial Production, Ongoing Yield Ramp and Global Customer Qualification

Beyond pricing adjustments and capacity expansion roadmaps, PSMC's in-house DRAM process development has entered a tangible execution phase. Its proprietary OneX DRAM technology kicked off low-volume trial production in June. The R&D team is now prioritizing continuous yield ramp, while conducting reliability and interoperability qualification procedures with domestic and overseas memory clients.

Backed by its self-owned process platform, PSMC can deliver differentiated foundry solutions targeting the niche DRAM segment, covering consumer, industrial and automotive-grade memory applications. This move further solidifies the firm's technological competitive edge in specialty memory manufacturing, freeing it from overreliance on pure third-party foundry operations. Proprietary process technology enables stable in-house supply capacity, laying technical groundwork to fill upcoming new capacity and unlock incremental revenue streams.

Joint OneP Advanced Node Co-Development with Micron, Targeting Mid-2028 Mass Production 

For long-term advanced DRAM node iteration, the OneP manufacturing process co-developed by PSMC and Micron is scheduled to finish full tool move-in in Q1 2027, with mass production targeted for mid-2028. The OneP process can produce 2.5 times more functional dies per wafer than PSMC's legacy manufacturing nodes, building a robust technical foundation for future growth in the niche DRAM market.

PSMC collaborates closely with Micron, drawing on the latter's technical expertise to refine its DRAM fabrication technologies. The jointly developed advanced node program maintains steady progress, jointly driving DRAM manufacturing toward smaller, more advanced process geometries.