Samsung Reportedly Building Hybrid Bonding Mass-Production Line at Pyeongtaek Campus

According to Korean media reports, Samsung Electronics is building a mass-production line at its Pyeongtaek campus that can accommodate 50 die-to-wafer (D2W) hybrid bonding equipments, for the production of next-generation high-bandwidth memory (HBM) and logic chips. Equipment delivery and installation are expected to begin by the end of this year. The reports also indicate that Samsung Electronics internally predicts that large-scale mass production of hybrid bonding technology will not be realized until 2030.