Report: Samsung Sets Up Hybrid Bonding Mass Production Line in Pyeongtaek

According to South Korean media, Samsung Electronics is constructing a mass production line at its Pyeongtaek campus capable of accommodating 50 die-to-wafer (D2W) hybrid bonding machines. This line will be used to manufacture next-generation High Bandwidth Memory (HBM) and logic chips. The delivery and installation of the equipment are expected to begin by the end of this year. The report also notes that Samsung internally predicts that large-scale mass production utilizing hybrid bonding technology will not be realized until 2030.