Guangli Technology: Semiconductor Slicing Equipment Enters Leading Packaging and Testing Companies and is Being Supplied in Batches

Recently, Guangli Technology disclosed in an investor relations activity that its domestically produced semiconductor mechanical slicing equipment has achieved cutting quality and efficiency comparable to international leading models, successfully entering leading packaging and testing companies and achieving batch supply. This marks a significant breakthrough in the domestic substitution of high-end slicing equipment.

The company's semiconductor business customers are mainly IDM and OSAT manufacturers, with large customer orders accounting for approximately half of new domestic business orders. Regarding semiconductor cutting tools, some models of domestically produced soft cutting tools have already been supplied in batches, while hard cutting tool products are undergoing customer verification.

In terms of capacity layout, the second phase of the Zhengzhou Airport Economic Zone plant project is progressing rapidly, adopting a construction-and-production-simultaneous model. It is expected that after full completion and commissioning in the first quarter of 2027, the new capacity will be more than three times the existing capacity.